4-By-4 Register Files With 3-State Outputs 20-LCCC -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| Factory Lead Time | 1 week |
| 最长访问时间 | 45 ns |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 内存密度 | 16 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 20 |
| 字数 | 4 words |
| 字数代码 | 4 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4X4 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 2.03 mm |
| 最大待机电流 | 0.05 A |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| SNJ54LS670FK | SN74LS670NSRG4 | 7704201EA | 7704201FA | SN54LS670J | SNJ54LS670J | FP-8999SD-01-2701-JD | SN74LS670 | SN54LS670 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 4-By-4 Register Files With 3-State Outputs 20-LCCC -55 to 125 | Registers 4 by 4 Registr Files | 4-By-4 Register Files With 3-State Outputs 16-CDIP -55 to 125 | 4-By-4 Register Files With 3-State Outputs 16-CFP -55 to 125 | 4-By-4 Register Files With 3-State Outputs 16-CDIP -55 to 125 | 4-By-4 Register Files With 3-State Outputs 16-CDIP -55 to 125 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.05W, 2700ohm, 50V, 5% +/-Tol, -100,100ppm/Cel, 3925, | SN74LS670 4-by-4 register files with 3-state outputs | SN54LS670 4-By-4 Register Files With 3-State Outputs |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - |
| 零件包装代码 | QLCC | SOIC | DIP | DFP | DIP | DIP | - | - | - |
| 包装说明 | LCC-20 | SOP, SOP16,.3 | DIP-16 | DFP-16 | DIP-16 | DIP-16 | - | - | - |
| 针数 | 20 | 16 | 16 | 16 | 16 | 16 | - | - | - |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant | compliant | - | - |
| ECCN代码 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | - | - |
| Factory Lead Time | 1 week | - | 1 week | 1 week | 6 weeks | 6 weeks | - | - | - |
| 最长访问时间 | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | - | - | - |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G16 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | - | - | - |
| 长度 | 8.89 mm | 10.2 mm | 19.56 mm | 10.3 mm | 19.56 mm | 19.56 mm | - | - | - |
| 内存密度 | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | 16 bit | - | - | - |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | - | - |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | - | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 端子数量 | 20 | 16 | 16 | 16 | 16 | 16 | 16 | - | - |
| 字数 | 4 words | 4 words | 4 words | 4 words | 4 words | 4 words | - | - | - |
| 字数代码 | 4 | 4 | 4 | 4 | 4 | 4 | - | - | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | - |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -65 °C | - | - |
| 组织 | 4X4 | 4X4 | 4X4 | 4X4 | 4X4 | 4X4 | - | - | - |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - | - |
| 可输出 | NO | - | NO | NO | NO | NO | - | - | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - |
| 封装代码 | QCCN | SOP | DIP | DFP | DIP | DIP | - | - | - |
| 封装等效代码 | LCC20,.35SQ | SOP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | - | - | - |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | SMT | - | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | Qualified | Qualified | Not Qualified | Not Qualified | - | - | - |
| 座面最大高度 | 2.03 mm | 2 mm | 5.08 mm | 2.03 mm | 5.08 mm | 5.08 mm | - | - | - |
| 最大待机电流 | 0.05 A | - | 0.05 A | 0.05 A | 0.05 A | 0.05 A | - | - | - |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | - | - |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | - | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 表面贴装 | YES | YES | NO | YES | NO | NO | - | - | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TANTALUM NITRIDE/NICKEL CHROME | - | - |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - |
| 端子形式 | NO LEAD | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | - | - |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 宽度 | 8.89 mm | 5.3 mm | 6.92 mm | 6.73 mm | 6.92 mm | 6.92 mm | - | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
