Quadruple Bus Buffer Gates With 3-State Outputs 20-LCCC -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 6 weeks |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | HC/UH |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.006 A |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/6 V |
| 最大电源电流（ICC） | 0.16 mA |
| Prop。Delay @ Nom-Sup | 36 ns |
| 传播延迟（tpd） | 225 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| SNJ54HC125FK | SN74HC125PWG4 | 5962-87721012A | 5962-8772101CA | SN54HC125J | SNJ54HC125J | SN74HC125 | SN54HC125 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Quadruple Bus Buffer Gates With 3-State Outputs 20-LCCC -55 to 125 | Buffers & Line Drivers Quad Bus Buff Gate With 3-State Outputs | Quadruple Bus Buffer Gates With 3-State Outputs 20-LCCC -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | SN74HC125 Quadruple Bus Buffer Gates With 3-State Outputs | SN54HC125 Quadruple Bus Buffer Gates With 3-State Outputs |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | QLCC | TSSOP | QLCC | DIP | DIP | DIP | - | - |
| 包装说明 | QCCN, LCC20,.35SQ | TSSOP, TSSOP14,.25 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DIP-14 | DIP, DIP14,.3 | - | - |
| 针数 | 20 | 14 | 20 | 14 | 14 | 14 | - | - |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| Factory Lead Time | 6 weeks | - | 6 weeks | 6 weeks | 1 week | 6 weeks | - | - |
| 控制类型 | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - |
| 计数方向 | UNIDIRECTIONAL | - | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | - |
| 系列 | HC/UH | HC/UH | HC/UH | HC | HC/UH | HC/UH | - | - |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G14 | S-CQCC-N20 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - | - |
| 长度 | 8.89 mm | 5 mm | 8.89 mm | 19.43 mm | 19.56 mm | 19.56 mm | - | - |
| 负载电容（CL） | 150 pF | - | 50 pF | 50 pF | 150 pF | 150 pF | - | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | - |
| 最大I（ol） | 0.006 A | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | - | - |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | - | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | 20 | 14 | 20 | 14 | 14 | 14 | - | - |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | QCCN | TSSOP | QCCN | DIP | DIP | DIP | - | - |
| 封装等效代码 | LCC20,.35SQ | TSSOP14,.25 | LCC20,.35SQ | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | - |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | - | - |
| 包装方法 | TUBE | - | TUBE | TUBE | TUBE | TUBE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - | - |
| 最大电源电流（ICC） | 0.16 mA | - | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | - | - |
| Prop。Delay @ Nom-Sup | 36 ns | - | 36 ns | 36 ns | 36 ns | 36 ns | - | - |
| 传播延迟（tpd） | 225 ns | 190 ns | 225 ns | 225 ns | 225 ns | 225 ns | - | - |
| 认证状态 | Not Qualified | Not Qualified | Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 2.03 mm | 1.2 mm | 2.03 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | - | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | YES | YES | YES | NO | NO | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 8.89 mm | 4.4 mm | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - |
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