Hex Inverting Drivers 14-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 其他特性 | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V |
| 系列 | AS |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.56 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.048 A |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 0.012 mA |
| Prop。Delay @ Nom-Sup | 5 ns |
| 传播延迟（tpd） | 5 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| SN54AS1004AJ | 5962-88729012A | 5962-8872901CA | 5962-8872901DA | SNJ54AS1004AFK | SNJ54AS1004AJ | SNJ54AS1004AW | SN74ALS1004 | SN74AS1004A | SN54AS1004A | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Hex Inverting Drivers 14-CDIP -55 to 125 | Hex Inverting Drivers 20-LCCC -55 to 125 | Hex Inverting Drivers 14-CDIP -55 to 125 | Hex Inverting Drivers 14-CFP -55 to 125 | Hex Inverting Drivers 20-LCCC -55 to 125 | Hex Inverting Drivers 14-CDIP -55 to 125 | Hex Inverting Drivers 14-CFP -55 to 125 | SN74ALS1004 Hex Inverting Drivers | SN74AS1004A Hex Inverting Drivers | SN54AS1004A Hex Inverting Drivers |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - |
| 零件包装代码 | DIP | QFN | DIP | DFP | QFN | DIP | DFP | - | - | - |
| 包装说明 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DFP, FL14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DFP-14 | - | - | - |
| 针数 | 14 | 20 | 14 | 14 | 20 | 14 | 14 | - | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - |
| Factory Lead Time | 6 weeks | 6 weeks | 1 week | 1 week | 6 weeks | 6 weeks | 6 weeks | - | - | - |
| 其他特性 | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | IOH = 40MA @ VOH = 2V; IOL = 40MA @ VOL = 0.5V | - | - | - |
| 系列 | AS | AS | AS | AS | AS | AS | AS | - | - | - |
| JESD-30 代码 | R-GDIP-T14 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 | - | - | - |
| 长度 | 19.56 mm | 8.89 mm | 19.56 mm | 9.21 mm | 8.89 mm | 19.56 mm | 9.21 mm | - | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - | - |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | - | - | - |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | - | - | - |
| 功能数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | - | - | - |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 端子数量 | 14 | 20 | 14 | 14 | 20 | 14 | 14 | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - |
| 封装代码 | DIP | QCCN | DIP | DFP | QCCN | DIP | DFP | - | - | - |
| 封装等效代码 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | FL14,.3 | LCC20,.35SQ | DIP14,.3 | FL14,.25 | - | - | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | - | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 最大电源电流（ICC） | 0.012 mA | 27 mA | 27 mA | 27 mA | 27 mA | 27 mA | 12 mA | - | - | - |
| Prop。Delay @ Nom-Sup | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | - | - | - |
| 传播延迟（tpd） | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | - | - | - |
| 座面最大高度 | 5.08 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | 2.03 mm | - | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 表面贴装 | NO | YES | NO | YES | YES | NO | YES | - | - | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | FLAT | - | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | - | - |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 宽度 | 7.62 mm | 8.89 mm | 6.67 mm | 5.97 mm | 8.89 mm | 7.62 mm | 6.29 mm | - | - | - |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | - | - | - |
能源基础设施
微控制器 MCU
测试/测量
嵌入式系统
微控制器 MCU
能源基础设施
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