Fixed-Point Digital Signal Processor 429-CFCBGA -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA429,21X21,50 |
| 针数 | 429 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 22 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 200 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-CBGA-B429 |
| JESD-609代码 | e0 |
| 长度 | 27 mm |
| 低功率模式 | YES |
| DMA 通道数量 | 4 |
| 外部中断装置数量 | 4 |
| 端子数量 | 429 |
| 计时器数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | BGA |
| 封装等效代码 | BGA429,21X21,50 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 1.5,3.3 V |
| 认证状态 | Not Qualified |
| RAM(字数) | 524288 |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.57 V |
| 最小供电电压 | 1.43 V |
| 标称供电电压 | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| SMJ320C6203GLPM20 | 5962-0051001QXA | SM320C6203GLPM20 | SMJ320C6203 | |
|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 429-CFCBGA -55 to 125 | Fixed-Point Digital Signal Processor 429-CFCBGA -55 to 125 | Fixed-Point Digital Signal Processor 429-CFCBGA -55 to 125 | SMJ320C6203 Fixed-Point Digital Signal Processor |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | BGA | BGA | BGA | - |
| 包装说明 | BGA, BGA429,21X21,50 | BGA-429 | BGA, BGA429,21X21,50 | - |
| 针数 | 429 | 429 | 429 | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | - |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | - |
| 地址总线宽度 | 22 | 22 | 22 | - |
| 桶式移位器 | NO | NO | NO | - |
| 位大小 | 32 | 32 | 32 | - |
| 边界扫描 | YES | YES | YES | - |
| 最大时钟频率 | 200 MHz | 200 MHz | 200 MHz | - |
| 外部数据总线宽度 | 32 | 32 | 32 | - |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | - |
| 集成缓存 | YES | YES | YES | - |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | - |
| JESD-30 代码 | S-CBGA-B429 | S-CBGA-B429 | S-CBGA-B429 | - |
| JESD-609代码 | e0 | e0 | e0 | - |
| 长度 | 27 mm | 27 mm | 27 mm | - |
| 低功率模式 | YES | YES | YES | - |
| DMA 通道数量 | 4 | 4 | 4 | - |
| 外部中断装置数量 | 4 | 4 | 4 | - |
| 端子数量 | 429 | 429 | 429 | - |
| 计时器数量 | 2 | 2 | 2 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
| 封装代码 | BGA | BGA | BGA | - |
| 封装等效代码 | BGA429,21X21,50 | BGA429,21X21,50 | BGA429,21X21,50 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | - |
| 认证状态 | Not Qualified | Qualified | Not Qualified | - |
| RAM(字数) | 524288 | 131072 | 524288 | - |
| 筛选级别 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | - |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | - |
| 最大供电电压 | 1.57 V | 1.57 V | 1.57 V | - |
| 最小供电电压 | 1.43 V | 1.43 V | 1.43 V | - |
| 标称供电电压 | 1.5 V | 1.5 V | 1.5 V | - |
| 表面贴装 | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | BALL | BALL | BALL | - |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 27 mm | 27 mm | 27 mm | - |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - |
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