Low Distortion, Low Noise, General Purpose Audio Op Amp 8-SON -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | SON-8 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| Is Samacsys | N |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.00001 µA |
| 最小共模抑制比 | 100 dB |
| 标称共模抑制比 | 110 dB |
| 最大输入失调电压 | 2000 µV |
| JESD-30 代码 | S-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 2 |
| 负供电电压上限 | -20 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 座面最大高度 | 0.8 mm |
| 标称压摆率 | 9 V/us |
| 最大压摆率 | 5 mA |
| 供电电压上限 | 20 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 16000 kHz |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| OPA1678IDRGT | OPA1678IDGKR | DIP1999SD031581BD | DIP1999SD031581BF | OPA1678IDRGR | OPA1678 | OPA1679 | |
|---|---|---|---|---|---|---|---|
| 描述 | Low Distortion, Low Noise, General Purpose Audio Op Amp 8-SON -40 to 85 | Low Distortion, Low Noise, General Purpose Audio Op Amp 8-VSSOP -40 to 85 | Array/Network Resistor, Isolated, 0.2W, 1580ohm, 100V, 0.1% +/-Tol, -25,25ppm/Cel, 8025, | Array/Network Resistor, Isolated, 0.2W, 1580ohm, 100V, 0.1% +/-Tol, -25,25ppm/Cel, 8025, | Low Distortion, Low Noise, General Purpose Audio Op Amp 8-SON -40 to 85 | OPA1678 Low Distortion, Low Noise, General Purpose Audio Op Amp | OPA1679 Low Distortion, Low Noise, General Purpose Audio Op Amp |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | - | - |
| JESD-609代码 | e4 | e4 | e0 | e0 | e4 | - | - |
| 端子数量 | 8 | 8 | 16 | 16 | 8 | - | - |
| 最高工作温度 | 85 °C | 85 °C | 150 °C | 150 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | - | - |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | DIP | DIP | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn60Pb40) | Tin/Lead (Sn60Pb40) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
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