High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | HC |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.56 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 20000000 Hz |
| 最大I（ol） | 0.0052 A |
| 位数 | 1 |
| 功能数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/6 V |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Sup | 53 ns |
| 传播延迟（tpd） | 265 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 23 MHz |
| CD54HC74F3A | 5962-8685301CA | CD54HC74F | CD54HCT74F | CD54HCT74F3A | CD54HC74 | CD54HCT74 | CD74HC74 | CD74HCT74 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125 | High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125 | High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125 | High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125 | High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset 14-CDIP -55 to 125 | CD54HC74 High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset | CD54HCT74 High Speed CMOS Logic Dual Positive-Edge Trigger D Flip-Flops with Set and Reset | CD74HC74 High Speed CMOS Logic Dual Positive-Edge-Triggered D-Type Flip-Flops with Set and Reset | CD74HCT74 High Speed CMOS Logic Dual Positive-Edge-Triggered D Flip-Flops with Set and Reset |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | - | - | - | - |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - | - | - |
| 针数 | 14 | 14 | 14 | 14 | 14 | - | - | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - | - |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - | - | - | - |
| 系列 | HC | HCT | HC/UH | HCT | HCT | - | - | - | - |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - | - | - | - |
| 长度 | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | - | - | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - | - | - |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - | - | - |
| 最大频率@ Nom-Sup | 20000000 Hz | 16000000 Hz | 20000000 Hz | 16000000 Hz | 16000000 Hz | - | - | - | - |
| 最大I（ol） | 0.0052 A | 0.004 A | 0.0052 A | 0.004 A | 0.004 A | - | - | - | - |
| 位数 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - | - | - | - |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | - | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | - | - | - | - |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | - | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | - | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 电源 | 2/6 V | 5 V | 2/6 V | 5 V | 5 V | - | - | - | - |
| 最大电源电流（ICC） | 0.04 mA | 0.04 mA | 0.04 mA | 0.16 mA | 0.16 mA | - | - | - | - |
| 传播延迟（tpd） | 265 ns | 53 ns | 265 ns | 53 ns | 53 ns | - | - | - | - |
| 认证状态 | Not Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - | - | - |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 6 V | 5.5 V | 5.5 V | - | - | - | - |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V | - | - | - | - |
| 标称供电电压 (Vsup) | 4.5 V | 5 V | 4.5 V | 5 V | 5 V | - | - | - | - |
| 表面贴装 | NO | NO | NO | NO | NO | - | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - | - | - |
| 宽度 | 7.62 mm | 6.67 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - | - | - |
| 最小 fmax | 23 MHz | 16 MHz | 23 MHz | 16 MHz | 16 MHz | - | - | - | - |
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