CMOS Micropower Phase-Locked Loop 16-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 16 weeks |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.56 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 5 V |
| 标称供电电压 (Vsup) | 10 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| CD4046BF3A | 5962-9466401MEA | CD4046BF | CD4046B-MIL | CD4046B | |
|---|---|---|---|---|---|
| 描述 | CMOS Micropower Phase-Locked Loop 16-CDIP -55 to 125 | CMOS Micropower Phase-Locked Loop 16-CDIP -55 to 125 | CMOS Micropower Phase-Locked Loop 16-CDIP -55 to 125 | CD4046B-MIL CMOS Micropower Phase-Locked Loop | CD4046B CMOS Micropower Phase-Locked Loop |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | DIP | DIP | DIP | - | - |
| 包装说明 | DIP-16 | DIP, DIP16,.3 | DIP-16 | - | - |
| 针数 | 16 | 16 | 16 | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - |
| Factory Lead Time | 16 weeks | 16 weeks | 6 weeks | - | - |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | - | - |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | - | - |
| 长度 | 19.56 mm | 19.56 mm | 19.56 mm | - | - |
| 功能数量 | 1 | 1 | 1 | - | - |
| 端子数量 | 16 | 16 | 16 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | DIP | DIP | - | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 5/15 V | 5/15 V | 5/15 V | - | - |
| 认证状态 | Not Qualified | Qualified | Not Qualified | - | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | - | - |
| 最小供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - |
| 标称供电电压 (Vsup) | 10 V | 10 V | 10 V | - | - |
| 表面贴装 | NO | NO | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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