8-Bit, Dual 1.5 GSPS or Single 3.0 GSPS, Analog-to-Digital Converter (ADC) 128-CFP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | HQFP, QFP128,1.4SQ,20 |
| 针数 | 128 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 2.15 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 0.000667 µs |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-CQFP-G128 |
| 长度 | 19.558 mm |
| 最大线性误差 (EL) | 0.3516% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 2 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 128 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | OFFSET BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | HQFP |
| 封装等效代码 | QFP128,1.4SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, HEAT SINK/SLUG |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.9 V |
| 认证状态 | Not Qualified |
| 采样速率 | 1500 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 7.2136 mm |
| 最大压摆率 | 875 mA |
| 标称供电电压 | 1.9 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子节距 | 0.508 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 19.558 mm |
| Base Number Matches | 1 |
| ADC08D1520WGFQV | 5962F0721401VZC | ADC08D1520WGMPR | ADC08D1520QML-SP | |
|---|---|---|---|---|
| 描述 | 8-Bit, Dual 1.5 GSPS or Single 3.0 GSPS, Analog-to-Digital Converter (ADC) 128-CFP -55 to 125 | 8-Bit, Dual 1.5 GSPS or Single 3.0 GSPS, Analog-to-Digital Converter (ADC) 128-CFP -55 to 125 | 8-Bit, Dual 1.5 GSPS or Single 3.0 GSPS, Analog-to-Digital Converter (ADC) 128-CFP 25 | ADC08D1520QML-SP 8-Bit, Dual 1.5 GSPS or Single 3.0 GSPS, Analog-to-Digital Converter (ADC) |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 包装说明 | HQFP, QFP128,1.4SQ,20 | HQFP, | QFP, QFP128,1.4SQ,20 | - |
| Reach Compliance Code | compliant | compliant | compliant | - |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
| 最大模拟输入电压 | 2.15 V | 0.96 V | 2.15 V | - |
| 最长转换时间 | 0.000667 µs | 0.000667 µs | 0.000667 µs | - |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | - |
| JESD-30 代码 | S-CQFP-G128 | S-CQFP-G128 | S-CQFP-G128 | - |
| 长度 | 19.558 mm | 19.558 mm | 19.558 mm | - |
| 最大线性误差 (EL) | 0.3516% | 0.3516% | 0.3516% | - |
| 湿度敏感等级 | 1 | 1 | 1 | - |
| 模拟输入通道数量 | 2 | 2 | 2 | - |
| 位数 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | - |
| 端子数量 | 128 | 128 | 128 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - |
| 输出位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | - |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, 8 BITS | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
| 封装代码 | HQFP | HQFP | QFP | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | FLATPACK, HEAT SINK/SLUG | FLATPACK, HEAT SINK/SLUG | FLATPACK | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - |
| 认证状态 | Not Qualified | Qualified | Not Qualified | - |
| 采样速率 | 1500 MHz | 3000 MHz | 1500 MHz | - |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | - |
| 筛选级别 | MIL-STD-883 | MIL-PRF-38535 Class V | MIL-STD-883 | - |
| 座面最大高度 | 7.2136 mm | 3.556 mm | 7.2136 mm | - |
| 标称供电电压 | 1.9 V | 1.9 V | 1.9 V | - |
| 表面贴装 | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.508 mm | 0.508 mm | 0.508 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 总剂量 | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | - |
| 宽度 | 19.558 mm | 19.558 mm | 19.558 mm | - |
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