High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 21.34 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 2/6 V |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8960901EA | 5962-8875701EA | CD54HC4046AF | CD54HC4046AF3A | CD54HCT4046AF3A | CD54HC4046A | CD54HCT4046A | CD74HC4046A | CD74HCT4046A | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-CDIP -55 to 125 | CD54HC4046A High Speed CMOS Logic Phase-Locked-Loop with VCO | CD54HCT4046A High Speed CMOS Logic Phase-Locked-Loop with VCO | CD74HC4046A High Speed CMOS Logic Phase-Locked-Loop with VCO | CD74HCT4046A High Speed CMOS Logic Phase-Locked-Loop with VCO |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | - |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | - | - | - | - |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | - | - | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | - | - | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - | - |
| Factory Lead Time | 6 weeks | 1 week | 6 weeks | 6 weeks | 6 weeks | - | - | - | - |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | - | - | - | - |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | - | - | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | - | - | - |
| 长度 | 21.34 mm | 21.34 mm | 21.34 mm | 21.34 mm | 21.34 mm | - | - | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | - | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | - | - | - | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | - | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - | - | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 电源 | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V | - | - | - | - |
| 认证状态 | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - | - | - |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 6 V | 6 V | 5.5 V | - | - | - | - |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 2 V | 2 V | 4.5 V | - | - | - | - |
| 标称供电电压 (Vsup) | 3 V | 5 V | 3 V | 3 V | 5 V | - | - | - | - |
| 表面贴装 | NO | NO | NO | NO | NO | - | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - | - | - |
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