High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 1 week |
| 系列 | HCT |
| JESD-30 代码 | R-GDIP-T14 |
| 长度 | 19.56 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 最大I（ol） | 0.004 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Sup | 41 ns |
| 传播延迟（tpd） | 135 ns |
| 认证状态 | Qualified |
| 施密特触发器 | NO |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.67 mm |
| Base Number Matches | 1 |
| 5962-8688301CA | CD74HC08PWG4 | CD54HC08F | CD54HC08F3A | CD54HCT08F | CD54HCT08F3A | CD54HC08 | CD54HCT08 | CD74HC08 | CD74HCT08 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input AND Gates 14-TSSOP -55 to 125 | High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input AND Gates 14-CDIP -55 to 125 | CD54HC08 High Speed CMOS Logic Quad 2-Input AND Gates | CD54HCT08 High Speed CMOS Logic Quad 2-Input AND Gates | CD74HC08 High Speed CMOS Logic Quad 2-Input AND Gates | CD74HCT08 High Speed CMOS Logic Quad 2-Input AND Gates |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - |
| 零件包装代码 | DIP | TSSOP | DIP | DIP | DIP | DIP | - | - | - | - |
| 包装说明 | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - | - | - |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | - | - | - | - |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - | - |
| 系列 | HCT | HC/UH | HC/UH | HC | HCT | HCT | - | - | - | - |
| JESD-30 代码 | R-GDIP-T14 | R-PDSO-G14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - | - | - | - |
| 长度 | 19.56 mm | 5 mm | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | - | - | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - | - | - |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | - | - | - | - |
| 最大I（ol） | 0.004 A | 0.004 A | 0.0052 A | 0.0052 A | 0.004 A | 0.004 A | - | - | - | - |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | - | - | - | - |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | - | - | - | - |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | - | - | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - | - |
| 封装代码 | DIP | TSSOP | DIP | DIP | DIP | DIP | - | - | - | - |
| 封装等效代码 | DIP14,.3 | TSSOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | - | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | - | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 电源 | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | - | - | - | - |
| Prop。Delay @ Nom-Sup | 41 ns | 27 ns | 27 ns | 27 ns | 38 ns | 38 ns | - | - | - | - |
| 传播延迟（tpd） | 135 ns | 135 ns | 135 ns | 135 ns | 38 ns | 38 ns | - | - | - | - |
| 认证状态 | Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | - |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | - | - | - | - |
| 座面最大高度 | 5.08 mm | 1.2 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 6 V | 5.5 V | 5.5 V | - | - | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | - | - | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - | - |
| 表面贴装 | NO | YES | NO | NO | NO | NO | - | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - | - | - |
| 端子节距 | 2.54 mm | 0.65 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
| 宽度 | 6.67 mm | 4.4 mm | 6.67 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - | - | - |
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