High-Performance Impact-X
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL20,.3 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 52.5 MHz |
| 系统内可编程 | NO |
| JESD-30 代码 | R-GDFP-F20 |
| JTAG BST | NO |
| 专用输入次数 | 8 |
| I/O 线路数量 | |
| 输入次数 | 8 |
| 输出次数 | 8 |
| 产品条款数 | 64 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 0 I/O |
| 输出函数 | REGISTERED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 10 ns |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.45 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.92 mm |
| Base Number Matches | 1 |
| 5962-8515518SA | 5962-85155182A | 5962-8515518RA | TIBPAL16R8-10MFKB | TIBPAL16R8-10MJB | TIBPAL16R8-10MWB | TIBPAL16R8-10M | |
|---|---|---|---|---|---|---|---|
| 描述 | High-Performance Impact-X |
High-Performance Impact-X |
High-Performance Impact-X |
High-Performance Impact-X |
High-Performance Impact-X |
High-Performance Impact-X |
TIBPAL16R8-10M High-Performance Impact-X |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 零件包装代码 | DFP | QLCC | DIP | QLCC | DIP | DFP | - |
| 包装说明 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | - |
| 最大时钟频率 | 52.5 MHz | 52.5 MHz | 52.5 MHz | 52.5 MHz | 52.5 MHz | 52.5 MHz | - |
| 系统内可编程 | NO | NO | NO | NO | NO | NO | - |
| JESD-30 代码 | R-GDFP-F20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | - |
| JTAG BST | NO | NO | NO | NO | NO | NO | - |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 组织 | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | - |
| 输出函数 | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DFP | QCCN | DIP | QCCN | DIP | DFP | - |
| 封装等效代码 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | FL20,.3 | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | - |
| 传播延迟 | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | - |
| 认证状态 | Qualified | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | - |
| 座面最大高度 | 2.45 mm | 2.03 mm | 5.08 mm | 2.03 mm | 5.08 mm | 2.45 mm | - |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | YES | NO | YES | NO | YES | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 6.92 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 6.92 mm | - |
工业自动化与控制
TI技术论坛
stm32/stm8
淘e淘
嵌入式系统
国产芯片交流
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
