|
TSC2005IYZLT |
TSC2005IYZLR |
TSC2005 |
| 描述 |
Nano-Power Touch Screen Controller with SPI Serial Interface 28-DSBGA -40 to 85 |
Nano-Power Touch Screen Controller with SPI Serial Interface 28-DSBGA -40 to 85 |
TSC2005 Nano-Power Touch Screen Controller with SPI Serial Interface |
| Brand Name |
Texas Instruments |
Texas Instruments |
- |
| 是否无铅 |
不含铅 |
不含铅 |
- |
| 是否Rohs认证 |
符合 |
符合 |
- |
| 零件包装代码 |
BGA |
BGA |
- |
| 包装说明 |
VFBGA, |
VFBGA, |
- |
| 针数 |
28 |
28 |
- |
| Reach Compliance Code |
compliant |
compliant |
- |
| ECCN代码 |
EAR99 |
EAR99 |
- |
| Factory Lead Time |
6 weeks |
1 week |
- |
| JESD-30 代码 |
R-XBGA-B28 |
R-XBGA-B28 |
- |
| JESD-609代码 |
e1 |
e1 |
- |
| 长度 |
3.25 mm |
3.25 mm |
- |
| 湿度敏感等级 |
1 |
1 |
- |
| 功能数量 |
1 |
1 |
- |
| 端子数量 |
28 |
28 |
- |
| 最高工作温度 |
85 °C |
85 °C |
- |
| 最低工作温度 |
-40 °C |
-40 °C |
- |
| 封装主体材料 |
UNSPECIFIED |
UNSPECIFIED |
- |
| 封装代码 |
VFBGA |
VFBGA |
- |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
- |
| 封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
| 峰值回流温度(摄氏度) |
260 |
260 |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
- |
| 座面最大高度 |
0.625 mm |
0.625 mm |
- |
| 表面贴装 |
YES |
YES |
- |
| 电信集成电路类型 |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
- |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
- |
| 端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
| 端子形式 |
BALL |
BALL |
- |
| 端子节距 |
0.5 mm |
0.5 mm |
- |
| 端子位置 |
BOTTOM |
BOTTOM |
- |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| 宽度 |
2.75 mm |
2.75 mm |
- |
| Base Number Matches |
1 |
1 |
- |