Digital Bus Switch ICs Octal FETBus Switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | GREEN, PLASTIC, SOIC-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.825 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 传播延迟（tpd） | 0.24 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| SN74CBT3245CDWG4 | SN74CBT3245CDBRG4 | SN74CBT3245CPWG4 | SN74CBT3245CDGVRG4 | SN74CBT3245CPWRG4 | SN74CBT3245CRGYRG4 | SN74CBT3245CDBQRG4 | SN74CBT3245CDWRG4 | SN74CBT3245C | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal Bus Trnscvr With 3-State Outputs | Digital Bus Switch ICs Octal FETBus Switch | Digital Bus Switch ICs Octal FETBus Switch | SN74CBT3245C Octal FET Bus Switch With -2 V Undershoot Protection |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | SOIC | SSOP | TSSOP | SOIC | TSSOP | QFN | QSOP | SOIC | - |
| 包装说明 | GREEN, PLASTIC, SOIC-20 | GREEN, PLASTIC, SSOP-20 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25,16 | TSSOP, TSSOP20,.25 | HVQCCN, LCC20/24,.14X.18,20 | GREEN, PLASTIC, QSOP-20 | GREEN, PLASTIC, SOIC-20 | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - |
| 系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 12.825 mm | 7.2 mm | 6.5 mm | 5 mm | 6.5 mm | 4.5 mm | 8.65 mm | 12.825 mm | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 2 | 2 | 1 | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | SSOP | TSSOP | TSSOP | TSSOP | HVQCCN | SSOP | SOP | - |
| 封装等效代码 | SOP20,.4 | SSOP20,.3 | TSSOP20,.25 | TSSOP20,.25,16 | TSSOP20,.25 | LCC20/24,.14X.18,20 | SSOP20,.25 | SOP20,.4 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 传播延迟（tpd） | 0.24 ns | 0.24 ns | 0.24 ns | 0.24 ns | 0.24 ns | 0.24 ns | 0.24 ns | 0.24 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.65 mm | 2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1 mm | 1.75 mm | 2.65 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | - |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.4 mm | 0.65 mm | 0.5 mm | 0.635 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7.5 mm | 5.3 mm | 4.4 mm | 4.4 mm | 4.4 mm | 3.5 mm | 3.9 mm | 7.5 mm | - |
FPGA/CPLD
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FPGA/CPLD
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