Flip Flops Dual J-K Flip-Flops With Clear
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 其他特性 | MASTER SLAVE OPERATION |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.305 mm |
| 逻辑集成电路类型 | J-K FLIP-FLOP |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 40 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 15 MHz |
| SN74107NE4 | SN74LS107ANSRG4 | JM38510/00203BCA | M38510/00203BCA | SN54107J | SNJ54107J | SN74LS107A | SN54107 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flip Flops Dual J-K Flip-Flops With Clear | Flip Flops Dual J to K FlipFlop | Dual J-K Flip-Flops With Clear 14-CDIP -55 to 125 | Dual J-K Flip-Flops With Clear 14-CDIP -55 to 125 | Dual J-K Flip-Flops With Clear 14-CDIP -55 to 125 | Dual J-K Flip-Flops With Clear 14-CDIP -55 to 125 | SN74LS107A Dual J-K Flip-Flops With Clear | SN54107 Dual J-K Flip-Flops With Clear |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 零件包装代码 | DIP | SOIC | DIP | - | DIP | DIP | - | - |
| 包装说明 | DIP, DIP14,.3 | SOP, SOP14,.3 | DIP, | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP-14 | - | - |
| 针数 | 14 | 14 | 14 | - | 14 | 14 | - | - |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| 系列 | TTL/H/L | LS | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | - | - |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - | - |
| JESD-609代码 | e4 | e4 | e0 | e0 | e0 | - | - | - |
| 长度 | 19.305 mm | 10.2 mm | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | - | - |
| 逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | - | - |
| 位数 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | - | - |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | SOP | DIP | DIP | DIP | DIP | - | - |
| 封装等效代码 | DIP14,.3 | SOP14,.3 | - | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | - |
| 传播延迟（tpd） | 40 ns | 20 ns | 40 ns | 40 ns | 40 ns | 40 ns | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 5.08 mm | 2 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | NO | NO | NO | NO | - | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | - | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 触发器类型 | POSITIVE EDGE | NEGATIVE EDGE | POSITIVE EDGE | HIGH LEVEL | POSITIVE EDGE | POSITIVE EDGE | - | - |
| 宽度 | 7.62 mm | 5.3 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - | - |
| 最小 fmax | 15 MHz | 30 MHz | 15 MHz | 15 MHz | 15 MHz | 15 MHz | - | - |
| 最大频率@ Nom-Sup | - | 30000000 Hz | 15000000 Hz | 10000000 Hz | 15000000 Hz | 15000000 Hz | - | - |
| 最大I（ol） | - | 0.008 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | - | - |
| 包装方法 | - | TAPE AND REEL | TUBE | TUBE | TUBE | TUBE | - | - |
| 最大电源电流（ICC） | - | 6 mA | 20 mA | 40 mA | 20 mA | 20 mA | - | - |
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