Silicon Junction FETs (Small Signal)
2SK3426
Silicon N-Channel Junction
Unit: mm
For impedance conversion in low frequency
For electret capacitor microphone
I
Features
•
High mutual conductance g
m
•
Low noise voltage of NV
0.33
+0.05
–0.02
3
0.10
+0.05
–0.02
(0.40) (0.40)
0.80
±0.05
1.20
±0.05
5˚
0.15 min.
0.23
+0.05
–0.02
1
2
I
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Drain-source voltage
Drain-gate voltage
Drain-source current
Drain-gate current
Gate-source current
Allowable power dissipation
Operating ambient temperature
Storage temperature
Symbol
V
DSO
V
DGO
I
DSO
I
DGO
I
GSO
P
D
T
opr
T
stg
Rating
20
20
2
2
2
100
−20
to
+80
−55
to
+125
Unit
V
V
mA
mA
mA
mW
°C
°C
0 to 0.01
0.52
±0.03
5˚
1: Drain
2: Source
3: Gate
SSSMini3-F1 Package
Marking Symbol: 4E
I
Electrical Characteristics
T
a
=
25°C
±
3°C
Parameter
Drain current
Symbol
I
D
*1
Conditions
V
DS
=
2.0 V, R
D
=
2.2 kΩ
±
1%
V
DS
=
2.0 V, R
D
=
2.2 kΩ
±
1%, V
GS
=
0
V
D
=
2.0 V, V
GS
=
0, f
=
1 kHz
V
D
=
2.0 V, R
D
=
2.2 kΩ
±
1%
C
O
=
5 pF, A-Curve
V
D
=
2.0 V, R
D
=
2.2 kΩ
±
1%
C
O
=
5 pF, e
G
=
10 mV, f
=
1 kHz
V
D
=
12 V, R
D
=
2.2 kΩ
±
1%
C
O
=
5 pF, e
G
=
10 mV, f
=
1 kHz
V
D
=
1.5 V, R
D
=
2.2 kΩ
±
1%
C
O
=
5 pF, e
G
=
10 mV, f
=
1 kHz
V
D
=
2.0 V, R
D
=
2.2 kΩ
±
1%
C
O
=
5 pF, e
G
=
10 mV, f
=
1 kHz to 70 Hz
Min
100
107
660
Typ
Max
330
310
Unit
µA
µS
I
DSS
Mutual conductance
Noise voltage
Voltage gain
g
m
NV
G
V1
G
V2
G
V3
∆G
V
. f
*2
Voltage gain difference
G
V2
−
G
V1
G
V1
−
G
V3
1 300
8
µV
dB
−8.5
−5.0
−9.0
−3.0
−
0.5
−3.5
0
1.5
4.0
1.5
0
0
dB
Note) *1: I
D
is assured for I
DSS
.
*2:
∆G
V
. f is assured for AQL 0.065%. (the measurement method is used by source-grounded circuit.)
0.15 max.
0.15 min.
0.80
±0.05
1.20
±0.05
Publication date: April 2002
SJF00033AED
1
Request for your special attention and precautions in using the technical information
and semiconductors described in this book
(1) An export permit needs to be obtained from the competent authorities of the Japanese Govern-
ment if any of the products or technologies described in this book and controlled under the "Foreign
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(2) The technical information described in this book is limited to showing representative characteristics
and applied circuits examples of the products. It neither warrants non-infringement of intellectual
property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this book.
(4) The products described in this book are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
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Consult our sales staff in advance for information on the following applications:
•
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
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harm the human body.
•
Any applications other than the standard applications intended.
(5) The products and product specifications described in this book are subject to change without no-
tice for modification and/or improvement. At the final stage of your design, purchasing, or use of the
products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum
rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise,
we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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2002 MAY
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