Digital Bus Switch ICs QUAD FETBus Switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SSOP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| SN74CBT3126DBRG4 | SN74CBT3126DBRE4 | SN74CBT3126RGYRG4 | SN74CBT3126DRE4 | SN74CBT3126PWG4 | SN74CBT3126PWRE4 | SN74CBT3126PWE4 | SN74CBT3126DE4 | SN74CBT3126 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs QUAD FETBus Switch | Digital Bus Switch ICs Quadruple FET Bus Switch | Digital Bus Switch ICs Octal Bus Trnscvr With 3-State Outputs | Digital Bus Switch ICs Quadruple FET Bus Switch | Digital Bus Switch ICs QUAD FETBus Switch | Digital Bus Switch ICs Quadruple FET Bus Switch | Digital Bus Switch ICs Quadruple FET Bus Switch | Digital Bus Switch ICs Quadruple FET Bus Switch | SN74CBT3126 Quadruple FET Bus Switch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | SSOP | SSOP | QFN | SOIC | TSSOP | TSSOP | TSSOP | SOIC | - |
| 包装说明 | SSOP, SSOP14,.3 | SSOP, SSOP14,.3 | HVQCCN, LCC14/18,.14SQ,20 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 | - |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - |
| 其他特性 | - | BUS SWITCH | - | BUS SWITCH | - | BUS SWITCH | BUS SWITCH | BUS SWITCH | - |
| 系列 | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - |
| JESD-30 代码 | - | R-PDSO-G14 | S-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | - |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | - | 6.2 mm | 3.5 mm | 8.65 mm | 5 mm | 5 mm | 5 mm | 8.65 mm | - |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 湿度敏感等级 | - | 1 | 2 | 1 | 1 | 1 | 1 | 1 | - |
| 位数 | - | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - |
| 功能数量 | - | 1 | 4 | 1 | 4 | 1 | 1 | 1 | - |
| 端口数量 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 14 | 14 | 14 | 14 | 14 | 14 | 14 | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | SSOP | HVQCCN | SOP | TSSOP | TSSOP | TSSOP | SOP | - |
| 封装等效代码 | - | SSOP14,.3 | LCC14/18,.14SQ,20 | SOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | SOP14,.25 | - |
| 封装形状 | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 传播延迟（tpd） | - | 0.35 ns | 0.35 ns | 0.35 ns | 0.35 ns | 0.35 ns | 0.35 ns | 0.35 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 2 mm | 1 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | - | 0.65 mm | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | - |
| 端子位置 | - | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 5.3 mm | 3.5 mm | 3.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | 3.9 mm | - |
| Base Number Matches | - | - | - | 1 | 1 | 1 | 1 | 1 | - |
电源技术
FPGA/CPLD
模拟与混合信号
Microchip MCU
单片机
模拟与混合信号
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