
2-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing 12-WSON -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | HVSON, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | S-PDSO-N12 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 12 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| Base Number Matches | 1 |
| LDC1312QDNTTQ1 | LDC1314QRGHRQ1 | LDC1314QRGHTQ1 | LDC1312QDNTRQ1 | LDC1312-Q1 | LDC1314-Q1 | |
|---|---|---|---|---|---|---|
| 描述 | 2-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing 12-WSON -40 to 125 | 4-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing 16-WQFN -40 to 125 | 4-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing 16-WQFN -40 to 125 | 2-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing 12-WSON -40 to 125 | LDC1312-Q1 2-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing | LDC1314-Q1 4-channel, AEC-Q100 qualified, 12-bit Inductance-to-Digital Converter with I2C for Inductive Sensing |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - |
| 包装说明 | HVSON, | HVQCCN, | HVQCCN, | HVSON, | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - | - |
| Factory Lead Time | 1 week | 6 weeks | 1 week | 1 week | - | - |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | - | - |
| JESD-30 代码 | S-PDSO-N12 | S-PQCC-N16 | S-PQCC-N16 | S-PDSO-N12 | - | - |
| JESD-609代码 | e3 | e3 | e3 | e3 | - | - |
| 长度 | 4 mm | 4 mm | 4 mm | 4 mm | - | - |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 12 | 16 | 16 | 12 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | HVSON | HVQCCN | HVQCCN | HVSON | - | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | - |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | - | - |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| 表面贴装 | YES | YES | YES | YES | - | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | - |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 4 mm | 4 mm | 4 mm | 4 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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