Encoders, Decoders, Multiplexers & Demultiplexers 8Ln To 3Ln Priority Encoders
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 9.9 mm |
| 逻辑集成电路类型 | ENCODER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| 传播延迟（tpd） | 240 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| SN74HC148DTG4 | SN74HC148NSRG4 | SN54HC148J | SNJ54HC148FK | SNJ54HC148J | SN74HC148 | SN54HC148 | |
|---|---|---|---|---|---|---|---|
| 描述 | Encoders, Decoders, Multiplexers & Demultiplexers 8Ln To 3Ln Priority Encoders | Encoders, Decoders, Multiplexers & Demultiplexers 8Ln To 3Ln Priority Encoders | 8-Line To 3-Line Priority Encoders 16-CDIP -55 to 125 | 8-Line To 3-Line Priority Encoders 20-LCCC -55 to 125 | 8-Line To 3-Line Priority Encoders 16-CDIP -55 to 125 | SN74HC148 8-Line To 3-Line Priority Encoders | SN54HC148 8-Line To 3-Line Priority Encoders |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 零件包装代码 | SOIC | SOIC | DIP | QLCC | DIP | - | - |
| 包装说明 | SOP, SOP16,.25 | SOP, SOP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | - | - |
| 针数 | 16 | 16 | 16 | 20 | 16 | - | - |
| Reach Compliance Code | unknown | unknown | not_compliant | not_compliant | not_compliant | - | - |
| 其他特性 | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | - | - |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | - | - |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | - | - |
| JESD-609代码 | e4 | e4 | e0 | - | e0 | - | - |
| 长度 | 9.9 mm | 10.2 mm | 19.56 mm | 8.89 mm | 19.56 mm | - | - |
| 逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | - | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 16 | 16 | 16 | 20 | 16 | - | - |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | SOP | SOP | DIP | QCCN | DIP | - | - |
| 封装等效代码 | SOP16,.25 | SOP16,.3 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - | - |
| 传播延迟（tpd） | 240 ns | 240 ns | 285 ns | 285 ns | 285 ns | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 1.75 mm | 2 mm | 5.08 mm | 2.03 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | - | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | YES | YES | NO | YES | NO | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 3.9 mm | 5.3 mm | 7.62 mm | 8.89 mm | 7.62 mm | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
