Digital Bus Switch ICs Dual FETBus Switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 系列 | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.9 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 传播延迟（tpd） | 0.15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| SN74CBTD3305CDRG4 | SN74CBTD3305CDG4 | SN74CBTD3305CPWE4 | SN74CBTD3305CPWG4 | SN74CBTD3305CDE4 | SN74CBTD3305CDRE4 | SN74CBTD3305CPWRG3 | SN74CBTD3305C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs Dual FETBus Switch | Digital Bus Switch ICs Dual FETBus Switch | Digital Bus Switch ICs DUAL BUFFER GATE | Digital Bus Switch ICs Dual FETBus Switch | Digital Bus Switch ICs Dual FET Bus Switch | Digital Bus Switch ICs DUAL ANALOG SWITCH | Dual FET Bus Switch with -2 V Undershoot-Protection and Level Shifting 8-TSSOP -40 to 85 | SN74CBTD3305C Dual FET Bus Switch with -2 V Undershoot-Protection and Level Shifting |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | - |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | - |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant | - |
| 系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
| 长度 | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm | 4.9 mm | 4.4 mm | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | SOP | TSSOP | TSSOP | SOP | SOP | TSSOP | - |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 传播延迟（tpd） | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | 0.15 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm | 1.75 mm | 1.2 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3 mm | - |
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