MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 具有ADC | YES |
| 其他特性 | ALSO HAVING 512 BYTES OF INFORMATION FRAM |
| 地址总线宽度 | |
| 位大小 | 16 |
| CPU系列 | MSP430 |
| 最大时钟频率 | 16 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQCC-N32 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 湿度敏感等级 | 2 |
| I/O 线路数量 | 19 |
| 端子数量 | 32 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM（字节） | 4096 |
| ROM（单词） | 15872 |
| ROM可编程性 | FRAM |
| 座面最大高度 | 1 mm |
| 速度 | 16 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 1.8 V |
| 标称供电电压 | 2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| MSP430FR2633IRHBR | MSP430FR2633IYQWT | MSP430FR2632IYQWR | MSP430FR2632IYQWT | MSP430FR2633IYQWR | MSP430FR2532 | MSP430FR2533 | MSP430FR2632 | MSP430FR2633 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85 | MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85 | 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85 | 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85 | MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85 | MSP430FR2532 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate Touch Technology | MSP430FR2533 16 MHz Ultra-Low-Power Microcontroller with 16 KB FRAM, CapTIvate touch technology | MSP430FR2632 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology | MSP430FR2633 MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | - |
| 包装说明 | HVQCCN, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | - | - | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | - | - | - | - |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - | - | - | - |
| 具有ADC | YES | YES | YES | YES | YES | - | - | - | - |
| 位大小 | 16 | 16 | 16 | 16 | 16 | - | - | - | - |
| CPU系列 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | - | - | - | - |
| 最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | - | - | - | - |
| DAC 通道 | NO | NO | NO | NO | NO | - | - | - | - |
| DMA 通道 | NO | NO | NO | NO | NO | - | - | - | - |
| JESD-30 代码 | S-PQCC-N32 | R-PBGA-B24 | R-PBGA-B24 | R-PBGA-B24 | R-PBGA-B24 | - | - | - | - |
| JESD-609代码 | e4 | e1 | e1 | e1 | e1 | - | - | - | - |
| 长度 | 5 mm | 2.34 mm | 2.34 mm | 2.34 mm | 2.34 mm | - | - | - | - |
| 湿度敏感等级 | 2 | 1 | 1 | 1 | 1 | - | - | - | - |
| I/O 线路数量 | 19 | 17 | 17 | 17 | 17 | - | - | - | - |
| 端子数量 | 32 | 24 | 24 | 24 | 24 | - | - | - | - |
| 片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | - | - | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - | - |
| PWM 通道 | YES | YES | YES | YES | YES | - | - | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | - |
| 封装代码 | HVQCCN | VFBGA | VFBGA | VFBGA | VFBGA | - | - | - | - |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | - | - | - |
| RAM（字节） | 4096 | 4096 | 2048 | 2048 | 4096 | - | - | - | - |
| ROM（单词） | 15872 | 15872 | 8704 | 8704 | 15872 | - | - | - | - |
| ROM可编程性 | FRAM | FRAM | FRAM | FRAM | FRAM | - | - | - | - |
| 座面最大高度 | 1 mm | 0.625 mm | 0.625 mm | 0.625 mm | 0.625 mm | - | - | - | - |
| 速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | - | - | - | - |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - | - | - |
| 最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | - | - | - |
| 标称供电电压 | 2 V | 3 V | 3 V | 3 V | 3 V | - | - | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | - | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - |
| 端子形式 | NO LEAD | BALL | BALL | BALL | BALL | - | - | - | - |
| 端子节距 | 0.5 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | - | - | - | - |
| 端子位置 | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | - | - | - |
| 宽度 | 5 mm | 2.29 mm | 2.29 mm | 2.29 mm | 2.29 mm | - | - | - | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | - | - | - |
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