
HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor 8-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | VFBGA, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Date Of Intro | 2016-05-18 |
| Samacsys Description | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | R-PBGA-B8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.675 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| HDC1010YPAT | HDC1010 | HDC1010YPAR | |
|---|---|---|---|
| 描述 | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor 8-DSBGA -40 to 85 | HDC1010 HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor | |
| Brand Name | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 包装说明 | VFBGA, | - | VFBGA, |
| Reach Compliance Code | compliant | - | compliant |
| ECCN代码 | EAR99 | - | EAR99 |
| Factory Lead Time | 6 weeks | - | 6 weeks |
| Date Of Intro | 2016-05-18 | - | 2016-05-12 |
| Samacsys Description | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor | - | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | - | ANALOG CIRCUIT |
| JESD-30 代码 | R-PBGA-B8 | - | R-PBGA-B8 |
| 湿度敏感等级 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 8 | - | 8 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | VFBGA |
| 封装形状 | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.675 mm | - | 0.675 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | - | 3 V |
| 表面贴装 | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子形式 | BALL | - | BALL |
| 端子节距 | 0.5 mm | - | 0.5 mm |
| 端子位置 | BOTTOM | - | BOTTOM |
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