IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | COP800 |
| JESD-30 代码 | R-XDIP-T40 |
| JESD-609代码 | e0 |
| 端子数量 | 40 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 128 |
| ROM（单词） | 8192 |
| ROM可编程性 | UVPROM |
| 速度 | 0.333 MHz |
| 最大压摆率 | 25 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| COP888CFMHD-3 | COP888CFMHEL-1 | COP888CFMHEL-3 | COP888CFMHD-1 | COP884CFMHD-1 | COP884CFMHD-3 | |
|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,40PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,DIP,28PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
| JESD-30 代码 | R-XDIP-T40 | S-XQCC-J44 | S-XQCC-J44 | R-XDIP-T40 | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 40 | 44 | 44 | 40 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | QCCJ | QCCJ | DIP | DIP | DIP |
| 封装等效代码 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 128 | 128 | 128 | 128 | 128 | 128 |
| ROM（单词） | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 速度 | 0.333 MHz | 1 MHz | 0.333 MHz | 1 MHz | 1 MHz | 0.333 MHz |
| 最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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