Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | FCT |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 6.1 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-9220603MEX | 5962-9220605MFX | 5962-9220605M2X | 5962-9220601M2X | 5962-9220605MEX | 5962-9220601MFX | 5962-9220601MEX | 5962-9220603MFX | 5962-9220603M2X | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDFP16, CERAMIC, DFP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CQCC20, CERAMIC, LCC-20 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CQCC20, CERAMIC, LCC-20 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDFP16, CERAMIC, DFP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CDFP16, CERAMIC, DFP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | DIP | DFP | QLCC | QLCC | DIP | DFP | DIP | DFP | QLCC |
| 包装说明 | DIP, | CERAMIC, DFP-16 | QCCN, | CERAMIC, LCC-20 | DIP, | DFP, | CERAMIC, DIP-16 | DFP, | QCCN, |
| 针数 | 16 | 16 | 20 | 20 | 16 | 16 | 16 | 16 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 20 | 16 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | QCCN | QCCN | DIP | DFP | DIP | DFP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER |
| 传播延迟（tpd） | 6.1 ns | 5.2 ns | 5.2 ns | 9 ns | 5.2 ns | 9 ns | 9 ns | 6.1 ns | 6.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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