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5962-8954002XX

产品描述2KX8 OTPROM, 105ns, CQCC32
产品类别存储    存储   
文件大小41KB,共8页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
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5962-8954002XX概述

2KX8 OTPROM, 105ns, CQCC32

5962-8954002XX规格参数

参数名称属性值
厂商名称Renesas(瑞萨电子)
零件包装代码QFJ
包装说明QCCN,
针数32
Reach Compliance Codeunknown
ECCN代码EAR99
Base Number Matches1

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HM-6617
March 1997
2K x 8 CMOS PROM
Description
The HM-6617 is a 16,384 bit fuse link CMOS PROM in a 2K
word by 8-bit/word format with “Three-State” outputs. This
PROM is available in the standard 0.600 inch wide 24 pin
SBDIP, the 0.300 inch wide slimline SBDIP, and the JEDEC
standard 32 pad CLCC.
The HM-6617 utilizes a synchronous design technique. This
includes on-chip address latches and a separate output
enable control which makes this device ideal for applications
utilizing recent generation microprocessors. This design
technique, combined with the Intersil advanced self-aligned
silicon gate CMOS process technology offers ultra-low
standby current. Low ICCSB is ideal for battery applications
or other systems with low power requirements.
The Intersil NiCr fuse link technology is utilized on this and
other Intersil CMOS PROMs. This gives the user a PROM
with permanent, stable storage characteristics over the full
industrial and military temperature voltage ranges. NiCr fuse
technology combined with the low power characteristics of
CMOS provides an excellent alternative to standard bipolar
PROMs or NMOS EPROMs.
All bits are manufactured storing a logical “0” and can be
selectively programmed for a logical “1” at any bit location.
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA at 1MHz
• Fast Access Time. . . . . . . . . . . . . . . . . . . . . . . 90/120ns
• Industry Standard Pinout
• Single 5.0V Supply
• CMOS/TTL Compatible Inputs
• High Output Drive . . . . . . . . . . . . . . . . 12 LSTTL Loads
• Synchronous Operation
• On-Chip Address Latches
• Separate Output Enable
Ordering Information
PACKAGE TEMP. RANGE
SBDIP
SMD#
SLIM
SBDIP
SMD#
CLCC
SMD#
90ns
6617B-9
-55
o
C to +125
o
C 5962-
120ns
HM1-
6617-9
PKG.
NO.
D24.6
-40
o
C to +85
o
C HM1-
5962-
D24.6
8954002JA 8954001JA
HM6-
6617-9
D24.3
-40
o
C to +85
o
C HM6-
6617B-9
-55
o
C to +125
o
C 5962-
5962-
D24.3
8954002LA 8954001LA
-40
o
C to +85
o
C HM4-
6617B-9
HM4-
6617-9
J32.A
-55
o
C to +125
o
C 5962-
5962-
J32.A
8954002XA 8954001XA
Pinouts
HM-6617 (SBDIP)
TOP VIEW
A7
HM-6617 (CLCC)
TOP VIEW
V
CC
NC
NC
NC
NC
NC
PIN DESCRIPTION
PIN
29 A8
28 A9
27 NC
26 P
25 G
24 A10
23 E
22 Q7
21 Q6
DESCRIPTION
No Connect
Address Inputs
Chip Enable
Data Output
Power (+5V)
Output Enable
Output Enable
A7
A6
A5
A4
A3
A2
A1
A0
Q0
1
2
3
4
5
6
7
8
9
24 V
CC
23 A8
22 A9
21 P
20 G
19 A10
18 E
17 Q7
16 Q6
15 Q5
14 Q4
13 Q3
4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
NC 12
Q0 13
3
2
1
32 31 30
NC
A0-A10
E
Q
V
CC
G
P (Note)
Q1 10
Q2 11
GND 12
14 15 16 17 18 19 20
Q1
Q2
NC
Q3
Q4
GND
Q5
NOTE: P should be hardwired to V
CC
except during programming.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
File Number
3017.1
6-1

5962-8954002XX相似产品对比

5962-8954002XX 5962-8954002LX 5962-8954001XX 5962-8954002JX 5962-8954001LX 5962-8954001JX
描述 2KX8 OTPROM, 105ns, CQCC32 2KX8 OTPROM, 105ns, CDIP, SLIM, SIDE BRAZED, DIP-24 2KX8 OTPROM, 140ns, CQCC, CERAMIC, LCC-32 2KX8 OTPROM, 105ns, CDIP24 2KX8 OTPROM, 140ns, CDIP24 2KX8 OTPROM, 140ns, CDIP, SIDE BRAZED, DIP-24
零件包装代码 QFJ DIP QFJ DIP DIP DIP
包装说明 QCCN, DIP, DIP24,.3 QCCN, LCC32,.45X.55 CERAMIC, DIP-24 CERAMIC, DIP-24 DIP, DIP24,.6
针数 32 24 32 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Base Number Matches 1 1 1 1 1 1
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) - Renesas(瑞萨电子)
最长访问时间 - 105 ns 140 ns 105 ns 140 ns 140 ns
JESD-30 代码 - R-XDIP-T24 R-XQCC-N32 R-GDIP-T24 R-GDIP-T24 R-XDIP-T24
内存密度 - 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
内存集成电路类型 - OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
内存宽度 - 8 8 8 8 8
功能数量 - 1 1 1 1 1
端子数量 - 24 32 24 24 24
字数 - 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 - 2000 2000 2000 2000 2000
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 - 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 - -55 °C -55 °C -55 °C -55 °C -55 °C
组织 - 2KX8 2KX8 2KX8 2KX8 2KX8
封装主体材料 - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
封装代码 - DIP QCCN DIP DIP DIP
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE
并行/串行 - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 5.08 mm 3.05 mm 5.72 mm 5.08 mm 5.72 mm
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) - 5 V 5 V 5 V 5 V 5 V
表面贴装 - NO YES NO NO NO
技术 - CMOS CMOS CMOS CMOS CMOS
温度等级 - MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 - THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 - 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 - DUAL QUAD DUAL DUAL DUAL
宽度 - 7.62 mm 11.43 mm 15.24 mm 7.62 mm 15.24 mm

 
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