Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | FCT |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | IDENTITY COMPARATOR |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 7.3 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-8854303RX | 5962-8854302SX | 5962-88543032X | 5962-8854301SA | 5962-8854302RX | 5962-88543022X | 5962-8854303SX | 5962-8854302SA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 0.358 X 0.358 INCH, 0.100 INCH HEIGHT, CC-20 | CPACK-20, Tube | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 0.358 X 0.358 INCH, 0.100 INCH HEIGHT, CC-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20 | CPACK-20, Tube |
| 零件包装代码 | DIP | DFP | QFN | CPACK | DIP | QFN | DFP | CPACK |
| 包装说明 | DIP, | DFP, | QCCN, | CERPACK-20 | 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 | QCCN, | DFP, | DFP, FL20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | unknown | unknown | unknown | not_compliant |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-XDIP-T20 | R-XDFP-F20 | S-XQCC-N20 | R-GDFP-F20 | R-XDIP-T20 | S-XQCC-N20 | R-XDFP-F20 | R-GDFP-F20 |
| 逻辑集成电路类型 | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | QCCN | DFP | DIP | QCCN | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK |
| 传播延迟（tpd） | 7.3 ns | 9.5 ns | 7.3 ns | 15 ns | 9.5 ns | 9.5 ns | 7.3 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | - | TIN LEAD | TIN LEAD | TIN LEAD |
| 其他特性 | - | CASCADABLE | - | CASCADABLE | CASCADABLE | CASCADABLE | - | CASCADABLE |
| 座面最大高度 | - | 2.3368 mm | - | 2.3368 mm | 5.08 mm | 2.54 mm | - | 2.3368 mm |
| 端子节距 | - | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
| 宽度 | - | 6.9215 mm | - | 6.9215 mm | 7.62 mm | 8.89 mm | - | 6.9215 mm |
FPGA/CPLD
PCB设计
无线连接
PCB设计
stm32/stm8
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