Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | SOIC |
包装说明 | CERAMIC, MODULE, SMT, DIP-14/8 |
针数 | 14/8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | SCREENED TO 38510; MAX RISE TIME CAPTURED; MAX FAN OUT OF 10 LOADS |
系列 | TTL |
JESD-30 代码 | R-CDSO-G8 |
逻辑集成电路类型 | ACTIVE DELAY LINE |
功能数量 | 1 |
抽头/阶步数 | 5 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SOP |
封装等效代码 | SOP14,.65 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
可编程延迟线 | NO |
Prop。Delay @ Nom-Sup | 50 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.572 mm |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
总延迟标称(td) | 150 ns |
Base Number Matches | 1 |
GBTTLDL150MY | GBTTLDL050MY | GBTTLDL200MX | GBTTLDL075MX | GBTTLDL200MY | GBTTLDL125 | GBTTLDL100M | |
---|---|---|---|---|---|---|---|
描述 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, PDSO8, PLASTIC, MODULE, SMT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, TTL, CDSO8, CERAMIC, MODULE, SMT, DIP-14/8 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | CERAMIC, MODULE, SMT, DIP-14/8 | CERAMIC, MODULE, SMT, DIP-14/8 | SOP, SOP14,.65 | SOP, SOP14,.65 | CERAMIC, MODULE, SMT, DIP-14/8 | PLASTIC, MODULE, SMT, DIP-14/8 | CERAMIC, MODULE, SMT, DIP-14/8 |
针数 | 14/8 | 14/8 | 14/8 | 14/8 | 14/8 | 8 | 14/8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | SCREENED TO 38510; MAX RISE TIME CAPTURED; MAX FAN OUT OF 10 LOADS | SCREENED TO 38510; MAX RISE TIME CAPTURED; MAX FAN OUT OF 10 LOADS | SCREENED TO 38510; MAX RISE TIME CAPTURED; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | SCREENED TO 38510; MAX RISE TIME CAPTURED; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | SCREENED TO 38510; MAX RISE TIME CAPTURED; MAX FAN OUT OF 10 LOADS | MAX FAN OUT OF 10 LOADS; TESTED WITH NO LOAD CONDITIONS; MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. |
系列 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
JESD-30 代码 | R-CDSO-G8 | R-CDSO-G8 | R-CDSO-G8 | R-CDSO-G8 | R-CDSO-G8 | R-PDSO-G8 | R-CDSO-G8 |
逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
封装等效代码 | SOP14,.65 | SOP14,.65 | SOP14,.65 | SOP14,.65 | SOP14,.65 | SOP14,.65 | SOP14,.65 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程延迟线 | NO | NO | NO | NO | NO | NO | NO |
Prop。Delay @ Nom-Sup | 50 ns | 50 ns | 200 ns | 75 ns | 200 ns | 125 ns | 100 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
总延迟标称(td) | 150 ns | 50 ns | 200 ns | 75 ns | 200 ns | 125 ns | 100 ns |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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