CD54HC356F
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I(ol) | 0.006 A |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 77 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| CD54HC356F | CD54HC356H | CD54HCT356F | CD74HCT356M96 | CD74HC356M96 | CD54HCT356H | |
|---|---|---|---|---|---|---|
| 描述 | CD54HC356F | CD54HC356H | CD54HCT356F | CD74HCT356M96 | CD74HC356M96 | CD54HCT356H |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | not_compliant | unknown |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装等效代码 | DIP20,.3 | DIE OR CHIP | DIP20,.3 | SOP20,.4 | SOP20,.4 | DIE OR CHIP |
| 电源 | 2/6 V | 2/6 V | 5 V | 5 V | 2/6 V | 5 V |
| Prop。Delay @ Nom-Sup | 77 ns | 77 ns | 77 ns | 79 ns | 64 ns | 94 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| JESD-30 代码 | R-XDIP-T20 | - | R-XDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
| 端子数量 | 20 | - | 20 | 20 | 20 | - |
| 封装主体材料 | CERAMIC | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | - | DIP | SOP | SOP | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | - |
| 表面贴装 | NO | - | NO | YES | YES | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | GULL WING | - |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | - |
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