Datasheet> 器件分类 > 存储> 存储> IS62LV25616ALL-85T

文档预览

IS62LV25616ALL-85T: 产品描述Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44; 产品类别存储存储; 文件大小57KB，共10页; 制造商Integrated Silicon Solution ( ISSI )

下载文档详细参数选型对比全文预览

IS62LV25616ALL-85T概述

Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44

IS62LV25616ALL-85T规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Integrated Silicon Solution ( ISSI )
零件包装代码	TSOP2
包装说明	TSOP2-44
针数	44
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	85 ns
I/O 类型	COMMON
JESD-30 代码	R-PDSO-G44
JESD-609代码	e0
长度	18.41 mm
内存密度	4194304 bit
内存集成电路类型	STANDARD SRAM
内存宽度	16
功能数量	1
端子数量	44
字数	262144 words
字数代码	256000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	256KX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP2
封装等效代码	TSOP44,.46,32
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
电源	3/3.3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.00001 A
最小待机电流	1.5 V
最大压摆率	0.04 mA
最大供电电压 (Vsup)	3.45 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.8 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	10.16 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

IS62LV25616ALL

256K x 16 LOW VOLTAGE, ULTRA

LOW POWER CMOS STATIC RAM

FEATURES

• High-speed access time: 70 and 85 ns

• CMOS low power operation

– 135 mW (typical) operating

– 16.5 µW (typical) CMOS standby

• TTL compatible interface levels

• Single 2.7V (min) to 3.45V (max) V

power supply

• Fully static operation: no clock or refresh

required

• Three state outputs

• Data control for upper and lower bytes

• Industrial temperature available

• Available in the 44-pin TSOP (Type II) and

48-pin mini BGA (8mm x 10mm and 7.2mm x 8.7mm)

ISSI

DESCRIPTION

PRELIMINARY INFORMATION

MARCH 2002

The

ISSI

IS62LV25616ALL is high-speed, 4,194,304 bit

static RAM organized as 262,144 words by 16 bits. It is

fabricated using

ISSI

's high-performance CMOS

technology. This highly reliable process coupled with

innovative circuit design techniques, yields high-performance

and low power consumption devices.

When

is HIGH (deselected) or when

is low and both

and

are HIGH, the device assumes a standby mode at which the

power dissipation can be reduced down with CMOS input levels.

Easy memory expansion is provided by using Chip Enable and

Output Enable inputs,

and

OE.

The active LOW Write Enable

(WE) controls both writing and reading of the memory. A data byte

allows Upper Byte (UB) and Lower Byte (LB) access.

The IS62LV25616ALL is packaged in the JEDEC standard

44-pin TSOP (Type II) and 48-pin mini BGA (8mm x 10mm

and 7.2mm x 8.7mm).

FUNCTIONAL BLOCK DIAGRAM

A0-A17

DECODER

256K x 16

MEMORY ARRAY

VCC

GND

I/O0-I/O7

Lower Byte

I/O8-I/O15

Upper Byte

I/O

DATA

CIRCUIT

COLUMN I/O

CONTROL

CIRCUIT

This document contains PRELIMINARY INFORMATION data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible

Integrated Silicon Solution, Inc. — 1-800-379-4774

Rev. 00A

03/21/02

IS62LV25616ALL-85T相似产品对比

	IS62LV25616ALL-85T	IS62LV25616ALL-85MI	IS62LV25616ALL-85TI	IS62LV25616ALL-85M	IS62LV25616ALL-85BI	IS62LV25616ALL-70BI	IS62LV25616ALL-70MI	IS62LV25616ALL-70B	IS62LV25616ALL-70M	IS62LV25616ALL-70T
描述	Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, TSOP2-44
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	TSOP2	BGA	TSOP2	BGA	BGA	BGA	BGA	BGA	BGA	TSOP2
包装说明	TSOP2-44	7.20 X 8.70 MM, MINI, BGA-48	TSOP2-44	7.20 X 8.70 MM, MINI, BGA-48	8 X 10 MM, MINI, BGA-48	8 X 10 MM, MINI, BGA-48	7.20 X 8.70 MM, MINI, BGA-48	8 X 10 MM, MINI, BGA-48	7.20 X 8.70 MM, MINI, BGA-48	TSOP2-44
针数	44	48	44	48	48	48	48	48	48	44
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	85 ns	85 ns	85 ns	85 ns	85 ns	70 ns	70 ns	70 ns	70 ns	70 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	18.41 mm	8.7 mm	18.41 mm	8.7 mm	10 mm	10 mm	8.7 mm	10 mm	8.7 mm	18.41 mm
内存密度	4194304 bit	4194304 bi	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bi	4194304 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	44	48	44	48	48	48	48	48	48	44
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	70 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C
组织	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP2	LFBGA	TSOP2	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	TSOP2
封装等效代码	TSOP44,.46,32	BGA48,6X8,32	TSOP44,.46,32	BGA48,6X8,32	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,32	BGA48,6X8,30	BGA48,6X8,32	TSOP44,.46,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.3 mm	1.2 mm	1.3 mm	1.35 mm	1.35 mm	1.3 mm	1.35 mm	1.3 mm	1.2 mm
最大待机电流	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
最小待机电流	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
最大压摆率	0.04 mA	0.045 mA	0.045 mA	0.04 mA	0.045 mA	0.05 mA	0.05 mA	0.045 mA	0.045 mA	0.045 mA
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	BALL	GULL WING	BALL	BALL	BALL	BALL	BALL	BALL	GULL WING
端子节距	0.8 mm	0.75 mm	0.8 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.8 mm
端子位置	DUAL	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	DUAL
处于峰值回流温度下的最长时间	30	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30
宽度	10.16 mm	7.2 mm	10.16 mm	7.2 mm	8 mm	8 mm	7.2 mm	8 mm	7.2 mm	10.16 mm
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Base Number Matches	1	1	1	1	1	1	-	-	-	-
湿度敏感等级	-	3	-	3	3	3	3	3	3	-

IS62LV25616ALL-85T

IS62LV25616ALL-85T概述

IS62LV25616ALL-85T规格参数

文档预览

IS62LV25616ALL-85T相似产品对比

推荐资源