Crystal unit
SMD HIGH-STABILITY CRYSTAL UNIT
MA-406H
• High-density mounting-type SMD.
• Excellent heat-resistance and environment capability.
• 9.6 MHz to 27.0 MHz available.
Actual size
Specifications (characteristics)
Item
Symbol
f
T
STG
T
OPR
GL
DL
T
SOL
∆
f/f
C
L
R
1
C
0
IR
fa
S. R.
Specifications
9.600 MHz to 27.000 MHz
-55˚C to +125˚C
-40˚C to 85˚C
2mW max.
10µW to 100µW
Only crystal oscillation is guaranteed
Remarks
Fundamental mode
Stored as bare product after unpacking
Nominal frequency range
Storage temperature
Temperature
range
Operable temperature
Drive level
Maximum drive level
Recommended drive level
Soldering condition (reflow)
Frequency tolerance (standard)
Frequency temperature characteristics
Load capacitance
Series resistance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
240˚C max. within 10 sec. and under 200˚C within 40 sec.
±10ppm
As per below table
10pF to
∞
As per below table
5.0pF max.
500 MΩ min.
±1ppm/year max.
±1ppm max.
Ta=25˚C ±1˚C, DL=100µW
Please specify
Operable temperature range, DL=100µW
Ta=25˚C±3˚C,DL=100µW
Three drops on a hard wooden board from 75 cm or
excitation test with 3000G x 0.3ms x 1/2 sine wave x 3
directions
Measured values for frequency tolerance and temperature characteristics need to be brought into mutual correlation prior to the start of production.
Metal may be exposed on the top of this product. This won't affect any quality, reliability or electrical spec.
Frequency temperature characteristics
Temperature range
0˚C to +50˚C
-10˚C to +60˚C
-20˚C to +70˚C
-30˚C to +80˚C
-40˚C to +85˚C
Series resistance
Frequency (MHz)
9.6
≤
f < 10.0
10.0
≤
f < 12.0
12.0
≤
f < 16.0
16.0
≤
f
≤
27.0
(Unit: mm)
Min. frequency specifications
± 3ppm min.
± 5ppm min.
± 7ppm min.
±10ppm min.
±15ppm min.
Series resistance (Ω)
50
Ω
max.
40
Ω
max.
30
Ω
max.
25
Ω
max.
(Unit: mm)
External dimensions
11.7 max.
#4
#3
Recommended soldering pattern
Internal connection
#4
4.8 max.
#3
1.8
7.8
1.8
#1
0.5
#2
3.7 max.
3.5
0.7
9.6
(1.2)
2.1
(1.2)
Do not connect #2 and #3 external device.
1.9
1.7
1.9
20.000M
E H51A
4.0
#1
#2
26
THE CRYSTALMASTER
ENERGY SAVING EPSON
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Energy Saving
Space saving technology
provides further reductions
in product size and weight
Power Saving
through super-precise pro-
cessing and high-density
assembly technology.
Space Saving
Time saving technology
shortens the time required
for design and development
Time Saving
on the customer side and
shortens delivery times.
Our concept of Energy Saving technology conserves
resources by blending the essence of these three efficiency
technologies. The essence of these technologies is repre-
sented in each of the products that we provide to our cus-
tomers.
In the industrial sector, leading priorities include mea-
sures to counter the greenhouse effect by reducing CO2,
measures to preserve the global environ-
ment, and the development of energy-
efficient products. Environmental
problems are of global concern, and
although the contribution of energy-
Resource
saving technology developed by
Saving
EPSON may appear insignificant,
we seek to contribute to the develop-
ment of energy-saving products by our
customers through the utilization of our electronic devices.
EPSON is committed to the conservation of energy, both
for the sake of people and of the planet on which we live.
SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification
by B.V.Q. I. (Bureau Veritas Quality International) .
ISO9001 in October, 1992.
ISO14001 in November,1997.
NOTICE
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko
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liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or
circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as,
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