Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 计数方向 | UP |
| 系列 | HCT |
| JESD-30 代码 | R-CDIP-T14 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | BINARY COUNTER |
| 最大频率@ Nom-Sup | 18000000 Hz |
| 工作模式 | ASYNCHRONOUS |
| 位数 | 4 |
| 功能数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 传播延迟（tpd） | 59 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535V;38534K;883S |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总剂量 | 200k Rad(Si) V |
| 触发器类型 | NEGATIVE EDGE |
| Base Number Matches | 1 |
| HCTS393DMSR | HCTS393D/SAMPLE | 5962R9575001VCC | 5962R9575001VXC | HCTS393K/SAMPLE | 5962R9575001V9A | HCTS393HMSR | |
|---|---|---|---|---|---|---|---|
| 描述 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDIP14, CERAMIC, DIP-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDFP14, CERAMIC, DFP-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, CDFP14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS, DIE-14 | Binary Counter, HCT Series, Asynchronous, Negative Edge Triggered, 4-Bit, Up Direction, CMOS |
| 包装说明 | DIP, DIP14,.3 | , | DIP, | DFP, | , | DIE, | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | UP | UP | UP | UP | UP | UP | UP |
| 系列 | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | X-XUUC-N14 | X-XUUC-N14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | NO | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | UNCASED CHIP | UNCASED CHIP |
| 传播延迟（tpd） | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns | 59 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | UPPER |
| 触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Harris | Harris | - | Harris | Harris | - | Harris |
| JESD-609代码 | e0 | - | e4 | e4 | - | e0 | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 封装代码 | DIP | - | DIP | DFP | - | DIE | DIE |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | GOLD | GOLD | - | TIN LEAD | - |
| 总剂量 | 200k Rad(Si) V | - | 100k Rad(Si) V | 100k Rad(Si) V | - | 100k Rad(Si) V | - |
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