4 Pad Ceramic Package, 5.5 mm x 11.9 mm
Product Features:
SMD Package
Supplied in Tape and Reel
Compatible with Leadfree Processing
ILCX05 Series
Applications:
PCMCIA Cards
Storage
PC’s
Wireless Lan
5.5
11.9
4
3
Frequency
3.5 MHz to 70 MHz
1
2
ESR (Equivalent Series Resistance)
3.5 MHz – 4.4 MHz
4.5 MHz – 6.9 MHz
7 MHz – 13.9 MHz
14 MHz – 25 MHz
rd
30 MHz – 70 MHz (3 O.T.)
200 Max.
100 Max.
70 Max.
50 Max.
100 Max.
H
1
2
4
3
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
7 pF Max.
30 ppm Standard (see Part Number Guide for more
options)
50 ppm Standard (see Part Number Guide for more
options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 uW Max.
5 ppm Max. / Year Standard
4.3
Connection Diagram
4
3
1
2
Recommended Pad Layout
2.4
2.1
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
5.1
Storage
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX05 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX05 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX05 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2a
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12+/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
