NAND Gate, S Series, 3-Func, 3-Input, TTL, CDIP14
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | S |
| JESD-30 代码 | R-CDIP-T14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 27 mA |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54S10/BCA | 54LS10/BCA | 54S11/BDA | 54S11/BCA | 54LS10/B2A | 54LS10/BDA | 54S10/BDA | |
|---|---|---|---|---|---|---|---|
| 描述 | NAND Gate, S Series, 3-Func, 3-Input, TTL, CDIP14 | NAND Gate, LS Series, 3-Func, 3-Input, TTL, CDIP14 | AND Gate, S Series, 3-Func, 3-Input, TTL, CDFP14 | AND Gate, S Series, 3-Func, 3-Input, TTL, CDIP14 | NAND Gate, LS Series, 3-Func, 3-Input, TTL, CQCC20 | NAND Gate, LS Series, 3-Func, 3-Input, TTL, CDFP14 | NAND Gate, S Series, 3-Func, 3-Input, TTL, CDFP14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | S | LS | S | S | LS | LS | S |
| JESD-30 代码 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDIP-T14 | S-CQCC-N20 | R-CDFP-F14 | R-CDFP-F14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | AND GATE | AND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK |
| 最大电源电流（ICC） | 27 mA | 3.3 mA | 42 mA | 42 mA | 3.3 mA | 3.3 mA | 27 mA |
| 传播延迟（tpd） | 9 ns | 24 ns | 14 ns | 14 ns | 24 ns | 24 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| 厂商名称 | - | YAGEO(国巨) | - | YAGEO(国巨) | YAGEO(国巨) | YAGEO(国巨) | YAGEO(国巨) |
模拟与混合信号
DSP 与 ARM 处理器
模拟电子
测试/测量
模拟与混合信号
嵌入式系统
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