Hermetically Sealed,
Very High Speed,
Logic Gate Optocouplers
Technical Data
HCPL-540X* HCPL-643X
5962-89570 5962-89571
HCPL-543X
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DSCC
Standard Microcircuit
Drawing
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Three Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55
°
C to +125
°
C
• High Speed: 40 M bit/s
• High Common Mode
Rejection 500 V/
µ
s
Guaranteed
• 1500 Vdc Withstand Test
Voltage
• Active (Totem Pole) Outputs
• Three Stage Output Available
• High Radiation Immunity
• HCPL-2400/30 Function
Compatibility
• Reliability Data
• Compatible with TTL, STTL,
LSTTL, and HCMOS Logic
Families
• Computer-Peripheral
Interfaces
• Switching Power Supplies
• Isolated Bus Driver
(Networking Applications)-
(5400/1/K Only)
• Pulse Transformer
Replacement
• Ground Loop Elimination
• Harsh Industrial
Environments
• High Speed Disk Drive I/O
• Digital Isolation for A/D,
D/A Conversion
Each channel contains an AlGaAs
light emitting diode which is
optically coupled to an integrated
high gain photon detector. This
combination results in very high
Truth Tables
(Positive Logic)
Multichannel Devices
Input
Output
On (H)
L
Off (L)
H
Description
These units are single and dual
channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the
appropriate DSCC Drawing. All
devices are manufactured and
tested on a MIL-PRF-38534
certified line and are included in
the DSCC Qualified Manufac-
turers List, QML-38534 for
Hybrid Microcircuits.
Single Channel DIP
Input
Enable
On (H)
L
Off (L)
L
On (H)
H
Off (L)
H
Output
L
H
Z
Z
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
E
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
• Isolation of High Speed
Logic Systems
V
O
GND
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
data rate capability. The detector
has a threshold with hysteresis,
which typically provides 0.25 mA
of differential mode noise
immunity and minimizes the
potential for output signal
chatter. The detector in the single
channel units has a three state
output stage which eliminates the
need for a pull-up resistor and
allows for direct drive of a data
bus.
All units are compatible with TTL,
STTL, LSTTL, and HCMOS logic
families. The 35 ns pulse width
distortion specification guaran-
tees a 10 MBd signaling rate at
+125°C with 35% pulse width
distortion. Figures 13 through 16
show recommended circuits for
reducing pulse width distortion
and optimizing the signal rate of
the product. Package styles for
these parts are 8 pin DIP through
hole (case outlines P), and
leadless ceramic chip carrier
(case outline 2). Devices may be
purchased with a variety of lead
bend and plating options. See
Selection Guide Table for details.
Standard Microcircuit Drawing
(SMD) parts are available for
each package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts.
Occasional exceptions exist due
to package variations and limita-
tions and are as noted. Addition-
ally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s perform-
ance for die related reliability and
certain limited radiation test
results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel
Wiring
Agilent Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Class K SMD Part #
Prescript for all below
Either Gold of Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
8 Pin DIP
Through Hole
1
None
8 Pin DIP
Through Hole
2
V
CC
, GND
20 Pad LCCC
Surface Mount
2
None
HCPL-5400
HCPL-5401
HCPL-540K
Gold Plate
Option #200
Option #100
Option #300
5962-
8957001PX
8957001PC
8957001PA
8957001YC
8957001YA
8957001XA
5962-
8957002KPX
8957002KPC
8957002KPA
8957002KYC
8957002KYA
8957002KXA
HCPL-5430
HCPL-5431
HCPL-543K
Gold Plate
Option #200
Option #100
Option #300
5962-
8957101PX
8957101PC
8957101PA
8957101YC
8957101YA
8957101XA
5962-
8957103KPX
8957103KPC
8957103KPA
8957103KYC
8957103KYA
8957103KXA
HCPL-6430
HCPL-6431
HCPL-643K
Solder Pads
5962-
89571022X
89571022A
5962-
8957104K2X
8957104K2A
3
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
7
V
O2
6
5
1
2
3
4
V
CC
V
E
8
7
6
5
1
2
3
4
V
CC
V
O1
8
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
20
V
O
GND
2
3
10
GND
Note:
All DIP devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate V
CC
and ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
4
Leaded Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
•
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
•
XXXX
XXXXXX
XXX 50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
* QUALIFIED PARTS ONLY
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead
finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details). This option has solder dipped leads.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
5
Absolute Maximum Ratings
(No derating required up to +125°C)
Storage Temperature Range, T
S
.................................. -65°C to +150°C
Operating Temperature, T
A
......................................... -55°C to +125°C
Case Temperature, T
C
................................................................ +170°C
Junction Temperature, T
J
.......................................................... +175°C
Lead Solder Temperature .............................................. 260°C for 10 s
Average Forward Current, I
F AVG
(each channel) ........................ 10 mA
Peak Input Current, I
F PK
(each channel) ............................... 20 mA
[1]
Reverse Input Voltage, V
R
(each channel) ....................................... 3 V
Supply Voltage, V
CC
............................................. 0.0 V min., 7.0 V max.
Average Output Current, I
O
............................ -25 mA min., 25 mA max.
(each channel)
Output Voltage, V
O
(each channel) ..................... -0.5 V min., 10 V max.
Output Power Dissipation, P
O
(each channel) ........................... 130 mW
Package Power Dissipation, P
D
(each channel) ......................... 200 mW
Single Channel Product Only
Three State Enable Voltage, V
E
........................... -0.5 V min., 10 V max.
8 Pin Ceramic DIP Single Channel Schematic
ANODE
V
E
V
O
CATHODE
Note enable pin 7. An external 0.01
µF
to 0.1
µF
bypass capacitor must be connected
between V
CC
and ground for each package type.
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5400/01/0K ............................................................ (∆∆ ), Class 2
HCPL-5430/31/3K and HCPL-6430/31/3K ....................... (Dot), Class 3
Recommended Operating Conditions
Parameter
Input Current (High)
Supply Voltage, Output
Input Voltage (Low)
Fan Out (Each Channel)
Symbol
I
F(ON)
V
CC
V
F(OFF)
N
Min.
6
4.75
–
–
Max.
10
5.25
0.7
5
Units
mA
V
V
TTL Loads
Single Channel Product Only
High Level Enable Voltage
V
EH
Low Level Enable Voltage
V
EL
2.0
0
V
CC
0.8
V
V
嵌入式系统
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