IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28, Analog to Digital Converter
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 3 V |
| 最小模拟输入电压 | -3 V |
| 最长转换时间 | 9 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-CQCC-N28 |
| 最大线性误差 (EL) | 0.0244% |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | SERIAL, PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Qualified |
| 采样并保持/跟踪并保持 | TRACK |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-9063201M3X | AD7870SE/883B | AD7870TE/883B | |
|---|---|---|---|
| 描述 | IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28, Analog to Digital Converter | IC 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28, Analog to Digital Converter | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, CQCC28, CERAMIC, LCC-28 |
| 零件包装代码 | QLCC | QLCC | QLCC |
| 包装说明 | QCCN, | CERAMIC, LCC-28 | CERAMIC, LCC-28 |
| 针数 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大模拟输入电压 | 3 V | 3 V | 3 V |
| 最小模拟输入电压 | -3 V | -3 V | -3 V |
| 最长转换时间 | 9 µs | 9 µs | 9 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 |
| 标称负供电电压 | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY |
| 输出格式 | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD | SERIAL, PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | QCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 |
| 最大线性误差 (EL) | 0.0244% | - | 0.0244% |
| 是否Rohs认证 | - | 不符合 | 不符合 |
| 厂商名称 | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| JESD-609代码 | - | e0 | e0 |
| 长度 | - | 11.43 mm | 11.43 mm |
| 封装等效代码 | - | LCC28,.45SQ | LCC28,.45SQ |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | 220 |
| 电源 | - | +-5 V | +-5 V |
| 采样速率 | - | 0.1 MHz | 0.1 MHz |
| 筛选级别 | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | - | 2.54 mm | 2.54 mm |
| 最大压摆率 | - | 13 mA | 13 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 30 |
| 宽度 | - | 11.43 mm | 11.43 mm |
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