54AC04DM概述

AC SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14

54AC04DM规格参数

参数名称	属性值
包装说明	DIP,
Reach Compliance Code	unknown
系列	AC
JESD-30 代码	R-GDIP-T14
长度	19.43 mm
负载电容（CL）	50 pF
逻辑集成电路类型	INVERTER
功能数量	6
输入次数	1
端子数量	14
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
传播延迟（tpd）	10 ns
认证状态	Not Qualified
座面最大高度	5.08 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	7.62 mm
Base Number Matches	1

54AC04DM相似产品对比

	54AC04DM	54AC04MDS	54AC04MW8	54AC04FM	54AC04MDA	54AC04LM	RM54AC04SDA	JM38510/75701BCA	JM38510/75701B2A	JM38510/75701BDA
描述	AC SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14	AC SERIES, HEX 1-INPUT INVERT GATE, UUC14	AC SERIES, HEX 1-INPUT INVERT GATE, UUC, DIE	AC SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14	AC SERIES, HEX 1-INPUT INVERT GATE, UUC14	AC SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20	AC SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERPACK-14	AC SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14	AC SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20	AC SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERPACK-14
包装说明	DIP,	DIE,	DIE,	DFP,	DIE,	QCCN,	DFP,	DIP,	QCCN,	DFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknown	unknown	unknown
系列	AC	AC	AC	AC	AC	AC	AC	AC	AC	AC
JESD-30 代码	R-GDIP-T14	R-XUUC-N14	X-XUUC-N	R-GDFP-F14	R-XUUC-N14	S-CQCC-N20	R-GDFP-F14	R-GDIP-T14	S-CQCC-N20	R-GDFP-F14
逻辑集成电路类型	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER	INVERTER
功能数量	6	6	6	6	6	6	6	6	6	6
输入次数	1	1	1	1	1	1	1	1	1	1
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED	UNSPECIFIED	UNSPECIFIED	CERAMIC, GLASS-SEALED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
封装代码	DIP	DIE	DIE	DFP	DIE	QCCN	DFP	DIP	QCCN	DFP
封装形状	RECTANGULAR	RECTANGULAR	UNSPECIFIED	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	IN-LINE	UNCASED CHIP	UNCASED CHIP	FLATPACK	UNCASED CHIP	CHIP CARRIER	FLATPACK	IN-LINE	CHIP CARRIER	FLATPACK
传播延迟（tpd）	10 ns	11 ns	11 ns	10 ns	11 ns	10 ns	11 ns	10 ns	10 ns	10 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	3.3 V	3.3 V	5 V	3.3 V	5 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	NO	YES	YES	YES	YES	YES	YES	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	NO LEAD	NO LEAD	FLAT	NO LEAD	NO LEAD	FLAT	THROUGH-HOLE	NO LEAD	FLAT
端子位置	DUAL	UPPER	UPPER	DUAL	UPPER	QUAD	DUAL	DUAL	QUAD	DUAL
端子数量	14	14	-	14	14	20	14	14	20	14
座面最大高度	5.08 mm	-	-	2.032 mm	-	1.905 mm	2.032 mm	5.08 mm	1.905 mm	2.032 mm
端子节距	2.54 mm	-	-	1.27 mm	-	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
宽度	7.62 mm	-	-	6.2865 mm	-	8.89 mm	6.2865 mm	7.62 mm	8.89 mm	6.2865 mm
Base Number Matches	1	1	1	1	1	1	-	-	-	-
厂商名称	-	-	-	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)

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