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CYM1836V33PM-20C

产品描述SRAM Module, 512KX8, 20ns, CMOS
产品类别存储    存储   
文件大小259KB,共7页
制造商Cypress(赛普拉斯)
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CYM1836V33PM-20C概述

SRAM Module, 512KX8, 20ns, CMOS

CYM1836V33PM-20C规格参数

参数名称属性值
厂商名称Cypress(赛普拉斯)
包装说明SIMM, SSIM64
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间20 ns
其他特性TTL COMPATIBLE INPUTS/OUTPUTS
I/O 类型COMMON
JESD-30 代码R-XSMA-N64
内存密度4194304 bit
内存集成电路类型SRAM MODULE
内存宽度8
功能数量1
端子数量64
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX8
输出特性3-STATE
封装主体材料UNSPECIFIED
封装代码SIMM
封装等效代码SSIM64
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
并行/串行PARALLEL
电源3.3 V
认证状态Not Qualified
座面最大高度15.113 mm
最大待机电流0.0008 A
最小待机电流2 V
最大压摆率0.48 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子节距1.27 mm
端子位置SINGLE
Base Number Matches1

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3
fax id: 2046
PRELIMINARY
CYM1836V33
128K x 32 3.3V Static RAM Module
Features
• High-density 3.3V 4-megabit SRAM module
• 32-bit standard footprint supports densities from 16K
x 32 through 1M x 32
• High-speed CMOS SRAMs
• Access time of 25 ns
— Low active power 1.6W (max.) at 20 ns
• 2.0V Data Retention (I
CCDRL
= 0.8 mA, max.)
• SMD technology
• TTL-compatible inputs and outputs
• Available in 64-pin SIMM, 64-pin ZIP format or 72-pin
SIMM format.
lects (CS
1
, CS
2
, CS
3
, CS
4
) are used to independently enable
the four bytes. Reading or writing can be executed on individ-
ual bytes or any combination of multiple bytes through proper
use of selects.
Writing to each byte is accomplished when the appropriate
chip select (CS) and write enable (WE) inputs are both LOW.
Data on the input/output pins (I/O) is written into the mem-
ory location specified on the address pins (A
0
through A
16
).
Reading the device is accomplished by taking the chip select
(CS) LOW while write enable (WE) remains HIGH. Under
these conditions, the contents of the memory location
specified on the address pins will appear on the data in-
put/output pins (I/O).
The data input/output pins stay at the high-impedance state
when write enable is LOW or the appropriate chip selects are
HIGH.
Two pins (PD
0
and PD
1
) are used to identify module mem-
ory density in applications where alternate versions of the
JEDEC-standard modules can be interchanged.
72-pin SIMM
Top View
NC
PD
3
PD
0
I/O
0
I/O
1
I/O
2
I/O
3
V
CC
A
7
A
8
A
9
I/O
4
I/O
5
I/O
6
I/O
7
WE
A
14
CS
1
CS
3
A
16
GND
I/O
16
I/O
17
I/O
18
I/O
19
A
10
A
11
A
12
A
13
I/O
20
I/O
21
I/O
22
I/O
23
GND
NC
NC
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
Functional Description
The CYM1836V33 is a 3.3V high-performance 4-megabit stat-
ic RAM module organized as 128K words by 32 bits. This mod-
ule is constructed from four 128K x 8 SRAMs in SOJ packages
mounted on an epoxy laminate board with pins. Four chip se-
Logic Block Diagram
Pin Configurations
64-pin ZIP/SIMM
Top View
PD
0
−OPEN
PD
1
−OPEN
PD
0
I/O
0
I/O
1
I/O
2
I/O
3
V
CC
A
7
A
8
A
9
I/O
4
I/O
5
I/O
6
I/O
7
WE
A
14
CS
1
CS
3
A
16
GND
I/O
16
I/O
17
I/O
18
I/O
19
A
10
A
11
A
12
A
13
I/O
20
I/O
21
I/O
22
I/O
23
GND
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
GND
PD
1
I/O
8
I/O
9
I/O
10
I/O
11
A
0
A
1
A
2
I/O
12
I/O
13
I/O
14
I/O
15
GND
A
15
CS
2
CS
4
NC
OE
I/O
24
I/O
25
I/O
26
I/O
27
A
3
A
4
A
5
V
CC
A
6
I/O
28
I/O
29
I/O
30
I/O
31
1836V33–2
A
0
A
16
OE
WE
17
PD
0
-
PD
1
-
PD
2
-
PD
3
-
OPEN
OPEN
OPEN
GND
128K x 8
SRAM
CS
1
128K x 8
SRAM
CS
2
128K x 8
SRAM
CS
3
128K x 8
SRAM
CS
4
4
I/O
0
−I/O
7
4
I/O
8
−I/O
15
NC
PD
2
GND
PD
1
I/O
8
I/O
9
I/O
10
I/O
11
A
0
A
1
A
2
I/O
12
I/O
13
I/O
14
I/O
15
GND
A
15
CS
2
CS
4
NC
OE
I/O
24
I/O
25
I/O
26
I/O
27
A
3
A
4
A
5
V
CC
A
6
I/O
28
I/O
29
I/O
30
I/O
31
A
18
NC
4
I/O
16
−I/O
23
4
I/O
24
−I/O
31
1836V33–1
1836V33–3
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
April 29, 1998

 
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