Hall IC
LT261A
2.9±0.2
1.9
2
0.4
3
0.4
0.95
X
4-R0.2
Hall device center line
X : +0.05±0.23mm against package center
Y : -0.05±0.1mm against package lead center between
No.2 and No.3 terminals
Z : 0.81±0.15mm from package surface
Terminal connections
1.5±0.2
0.6
0.6
REG
Hall
+
device
H
0.3
+0.2
1.1
-0.1
0.16
+0.10
-0.06
s
Applications
¡FDD
¡HDD
¡Water
meter
¡Car
stereo
¡Microswitch,
etc.
0.8
-
(0to0.15)
s
Absolute Maximum Ratings
Parameter
Supply voltage
Output voltage
Output current
Power dissipation
Operating temperature
Storage temperature
Soldering temperature
*1
*1 Soldering time : within 10 seconds
*No.3 terminal and the section of leads (both sides
of package in X direction) are connected with the
terminal of internal IC. Be careful in connecting other circuits.
1 : V
CC
2 : V
OUT
3 : Don't use.
4 : GND
(T
a
=25˚C)
Unit
V
V
mA
mW
˚C
˚C
˚C
Symbol
Rating
V
CC
18
18
V
OUT
5
I
O
100
P
D
-20 to +125
T
opr
-55 to +150
T
stg
260
T
sol
As for dimensions of tape-packaged products, refer to page 44 .
s
Operating Explanation
Output voltage
<Alternating magnetic field-type>
B
RP
0 B
OP
+B
Magnetic flux density
s
Electrical Characteristics
Parameter
Operating magnetic flux density
Hysteresis breadth
Operating voltage
Supply current
Low level output voltage
High level output voltage
Output short circuit current
Operating point temperature drift
Symbol
B
OP
B
RP
B
H
V
CC
I
CC
V
OL
V
OH
I
OS
∆B
OP
Conditions
V
CC
=16V
V
OO
=16V
V
CC
=16V, B=<-10mT
V
CC
=16V, I
O
=4mA, B>=10mT
V
CC
=16V, I
O
=-100µA, B=<-10mT
V
CC
=16V
V
CC
=16V, T
a
=-20˚C to +80˚C
MIN.
-
-10
-
4.5
-
-
13.9
-1.55
-6
TYP.
-
-
-
-
-
-
-
-
-
MAX.
10
-
5
16
10.5
0.4
-
-0.80
6
(T
a
=25˚C)
Unit
mT
mT
mT
V
mA
V
V
mA
mT
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices
shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device spcification sheets before using any SHARP device.
2.9±0.2
*Zero-cross is not warranted.
s
Features
¡Operation
by small magnet due to high sensitivity
s
Outline Demensions
(Unit : Fmm)
Operating point<10mT
2.7±0.3
¡Combining
a GaAs Hall device and an IC in a compact
Y
package (2.9X1.5X1.1mm)
1
4
¡Wide
operation temperature range obtained by GaAs Hall
device (-20 to +125˚C)
¡Long
life time due to noncontact-type
S
Z
0.4
0.6
0.85
LT261A
GaAs Hall IC for Noncontact Switch
(Alternating magnetic field-type*)
Hall IC
Fig. 1
Operating magnetic flux density B (mT)
LT261A
Operating Magnetic Flux Density
vs. Supply Voltage
T
a
=25˚C
Fig. 2
Operating magnetic flux density B (mT)
12
8
4
0
-4
-8
-12
Operating Magnetic Flux Density vs.
Ambient Temperature
V
CC
=16V
12
8
4
0
-4
-8
-12
0
B
OP
B
RP
B
OP
B
RP
4
8
12
16
Supply voltage V
CC
(V)
20
-40
0
40
80
120
Ambient temperature T
a
(˚C)
Fig. 3
10
8
6
4
2
Supply Current vs. Supply Voltage
B=<-10mT
T
a
=25˚C
Fig. 4
10
8
6
4
2
Supply Current vs. Ambient
Temperature
V
CC
=16V
B=<-10mT
Supply current I
CC
(mA)
Supply current I
CC
(mA)
0
0
4
8
12
16
Supply voltage V
CC
(V)
20
0
-40
0
40
80
120
Ambient temperature T
a
(˚C)
Fig. 5
1.0
Low level output voltage V
OL
(V)
Low Level Output Voltage vs.
Output Current
V
CC
=16V
B>=10mT
T
a
=25˚C
Fig. 6
1.0
Low Level Output Voltage vs.
Ambient Temperature
V
CC
=16V
I
O
=4mA
B>=10mT
Low level output voltage V
OL
(V)
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0
0
1
2
3
4
Output current I
O
(mA)
5
0
-40
0
40
80
120
Ambient temperature T
a
(˚C)
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