ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL20,.3 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH HOLD MODE |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 85000000 Hz |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 6.731 mm |
| 最小 fmax | 85 MHz |
| Base Number Matches | 1 |
| 54ACT377FMQB | 54ACT377DMQB | 54ACT377LMQB | 54AC377MW8 | JM38510/75603S2A | JM38510/75603SRA | JM54AC377BSA-RH | JM54AC377BSA-RH/NOPB | JM54AC377SSA-RH | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AC SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, UUC20 | OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP20, CERDIP-20 | AC SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | AC SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | AC SERIES, OCTAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
| 包装说明 | DFP, FL20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIE, | QCCN, | DIP, | DFP, | DFP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant | compliant | compliant |
| JESD-30 代码 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 | X-XUUC-N20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | R-GDFP-F20 | R-GDFP-F20 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 8 | 8 | 8 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | QCCN | DIE | QCCN | DIP | DFP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | UNSPECIFIED | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | UNCASED CHIP | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | QUAD | UPPER | QUAD | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | - | 不符合 | 符合 | 不符合 |
| 系列 | ACT | ACT | ACT | AC | - | - | AC | AC | AC |
| JESD-609代码 | e0 | e0 | e0 | - | - | - | e0 | - | e0 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | 260 | 260 | 260 |
| 传播延迟（tpd） | 12 ns | 12 ns | 12 ns | 15 ns | - | - | 15 ns | 15 ns | 15 ns |
| 座面最大高度 | 2.286 mm | 5.08 mm | 1.905 mm | - | 1.905 mm | 5.08 mm | 2.286 mm | 2.286 mm | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 6 V | - | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 2 V | - | - | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - | - | 3.3 V | 3.3 V | 3.3 V |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn63Pb37) |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | 40 |
| 宽度 | 6.731 mm | 7.62 mm | 8.89 mm | - | 8.89 mm | 7.62 mm | 6.731 mm | 6.731 mm | 6.731 mm |
| 最小 fmax | 85 MHz | 85 MHz | 85 MHz | 90 MHz | - | - | 95 MHz | 95 MHz | 95 MHz |
| 厂商名称 | - | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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