OP-AMP, 10 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, PDSO8
运算放大器, 10 uV 最大补偿, 0.8 MHz 波段 宽度, PDSO8
| 参数名称 | 属性值 |
| 最大输入失调电压 | 10 µV |
| 最大负供电电压 | -9 V |
| 额定负供电电压 | -5 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 85 Cel |
| 额定旋转率 | 0.8000 V/us |
| 最大供电/工作电压 | 9 V |
| 额定供电电压 | 5 V |
| 加工封装描述 | 0.150 INCH, PLASTIC, SOP-8 |
| each_compli | Yes |
| 状态 | Active |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| chitecture | CHOPPER-STAB |
| 最大输入偏置电流IIB | 1.50E-4 µA |
| bias_current_max__iib___25c | 5.00E-5 µA |
| 额定共模抑制比 | 130 dB |
| 最小共模抑制比 | 110 dB |
| frequency_compensati | YES |
| jesd_30_code | R-PDSO-G8 |
| jesd_609_code | e0 |
| low_bias | YES |
| low_offse | YES |
| micropowe | YES |
| moisture_sensitivity_level | 1 |
| 包装材料 | PLASTIC/EPOXY |
| ckage_code | SOP |
| ckage_equivalence_code | SOP8,.25 |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE |
| eak_reflow_temperature__cel_ | 235 |
| wer_supplies__v_ | +-5 |
| qualification_status | COMMERCIAL |
| seated_height_max | 1.75 mm |
| sub_category | Operational Amplifie |
| 最大供电电压 | 0.4500 mA |
| 表面贴装 | YES |
| 工艺 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子涂层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子间距 | 1.27 mm |
| 端子位置 | DUAL |
| ime_peak_reflow_temperature_max__s_ | 20 |
| unity_gain_bw_nom | 800 kHz |
| 最小电压增益 | 3.20E6 |
| length | 4.9 mm |
| width | 3.9 mm |
| LTC1049C | LTC1049 | |
|---|---|---|
| 描述 | OP-AMP, 10 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, PDSO8 | OP-AMP, 10 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, PDSO8 |
| 最大输入失调电压 | 10 µV | 10 µV |
| 最大负供电电压 | -9 V | -9 V |
| 额定负供电电压 | -5 V | -5 V |
| 功能数量 | 1 | 1 |
| 端子数量 | 8 | 8 |
| 最小工作温度 | -40 Cel | -40 Cel |
| 最大工作温度 | 85 Cel | 85 Cel |
| 额定旋转率 | 0.8000 V/us | 0.8000 V/us |
| 最大供电/工作电压 | 9 V | 9 V |
| 额定供电电压 | 5 V | 5 V |
| 加工封装描述 | 0.150 INCH, PLASTIC, SOP-8 | 0.150 INCH, PLASTIC, SOP-8 |
| each_compli | Yes | Yes |
| 状态 | Active | Active |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| chitecture | CHOPPER-STAB | CHOPPER-STAB |
| 最大输入偏置电流IIB | 1.50E-4 µA | 1.50E-4 µA |
| bias_current_max__iib___25c | 5.00E-5 µA | 5.00E-5 µA |
| 额定共模抑制比 | 130 dB | 130 dB |
| 最小共模抑制比 | 110 dB | 110 dB |
| frequency_compensati | YES | YES |
| jesd_30_code | R-PDSO-G8 | R-PDSO-G8 |
| jesd_609_code | e0 | e0 |
| low_bias | YES | YES |
| low_offse | YES | YES |
| micropowe | YES | YES |
| moisture_sensitivity_level | 1 | 1 |
| 包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| ckage_code | SOP | SOP |
| ckage_equivalence_code | SOP8,.25 | SOP8,.25 |
| 包装形状 | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE | SMALL OUTLINE |
| eak_reflow_temperature__cel_ | 235 | 235 |
| wer_supplies__v_ | +-5 | +-5 |
| qualification_status | COMMERCIAL | COMMERCIAL |
| seated_height_max | 1.75 mm | 1.75 mm |
| sub_category | Operational Amplifie | Operational Amplifie |
| 最大供电电压 | 0.4500 mA | 0.4500 mA |
| 表面贴装 | YES | YES |
| 工艺 | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子涂层 | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING |
| 端子间距 | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL |
| ime_peak_reflow_temperature_max__s_ | 20 | 20 |
| unity_gain_bw_nom | 800 kHz | 800 kHz |
| 最小电压增益 | 3.20E6 | 3.20E6 |
| length | 4.9 mm | 4.9 mm |
| width | 3.9 mm | 3.9 mm |
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