OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14
| 参数名称 | 属性值 |
| 厂商名称 | Harris |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-CDIP-T14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OR GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 20 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| HCS32D/SAMPLE | 5962R9578101VXC | 5962R9578101VCC | HCS32KMSR | HCS32HMSR | HCS32DMSR | 5962R9578101V9A | |
|---|---|---|---|---|---|---|---|
| 描述 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | OR Gate, HC/UH Series, 4-Func, 2-Input, CMOS, DIE-14 |
| 包装说明 | , | DFP, | , | DFP, FL14,.3 | DIE, | DIP, DIP14,.3 | DIE, |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-CDIP-T14 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 | X-XUUC-N14 | R-CDIP-T14 | X-XUUC-N14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP | IN-LINE | UNCASED CHIP |
| 传播延迟（tpd） | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Harris | - | Harris | Harris | Harris | Harris | Harris |
| JESD-609代码 | - | e4 | e4 | e0 | - | e0 | e0 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装代码 | - | DFP | - | DFP | DIE | DIP | DIE |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | GOLD | GOLD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN LEAD |
| 总剂量 | - | 100k Rad(Si) V | 100k Rad(Si) V | 200k Rad(Si) V | - | 200k Rad(Si) V | 100k Rad(Si) V |
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stm32/stm8
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