ISD2560/75/90/120
SINGLE-CHIP, MULTIPLE-MESSAGES,
VOICE RECORD/PLAYBACK DEVICE
60-, 75-, 90-, AND 120-SECOND DURATION
-1-
Publication Release Date: April 24, 2006
Revision 1.2
ISD2560/75/90/120
1. GENERAL DESCRIPTION
Winbond’s ISD2500 ChipCorder
®
Series provide high-quality, single-chip, Record/Playback solutions
for 60- to 120-second messaging applications. The CMOS devices include an on-chip oscillator,
microphone preamplifier, automatic gain control, antialiasing filter, smoothing filter, speaker amplifier,
and high density multi-level storage array. In addition, the ISD2500 is microcontroller compatible,
allowing complex messaging and addressing to be achieved. Recordings are stored into on-chip
nonvolatile memory cells, providing zero-power message storage. This unique, single-chip solution is
made possible through Winbond’s patented multilevel storage technology. Voice and audio signals are
stored directly into memory in their natural form, providing high-quality, solid-state voice reproduction.
2. FEATURES
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Easy-to-use single-chip, voice record/playback solution
High-quality, natural voice/audio reproduction
Single-chip with duration of 60, 75, 90, or 120 seconds.
Manual switch or microcontroller compatible
Playback can be edge- or level-activated
Directly cascadable for longer durations
Automatic power-down (push-button mode)
- Standby current 1 µA (typical)
Zero-power message storage
- Eliminates battery backup circuits
Fully addressable to handle multiple messages
100-year message retention (typical)
100,000 record cycles (typical)
On-chip clock source
Programmer support for play-only applications
Single +5 volt power supply
Available in die form, PDIP, SOIC and TSOP packaging
Packaged type: leaded and lead-free
Temperature = die (0°C to +50°C) and package (0°C to +70°C)
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ISD2560/75/90/120
3. BLOCK DIAGRAM
Internal Clock
XCLK
Timing
Sampling Clock
ANA IN
Amp
5-Pole Active
Antialiasing Filter
Decoders
Analog Transceivers
480K Cell
Nonvolatile
Multilevel Storage
Array
ANA OUT
MIC
MIC REF
AGC
Pre-
Amp
Automatic
Gain Control
(AGC)
Power Conditioning
5-Pole Active
Smoothing Filter
SP +
Mux
Amp
SP -
Address Buffers
Device Control
V
CCA
V
SSA
V
SSD
V
CCD
A0 A1 A2 A3
A4 A5 A6 A7 A8
A9
PD
OVF
P/R
CE
EOM
AUX IN
-3-
Publication Release Date: April 24, 2006
Revision 1.2
ISD2560/75/90/120
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM............................................................................................................................... 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19
9.1 Operating Conditions ................................................................................................................... 20
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21
10.1. Parameters For Packaged Parts .............................................................................................. 21
10.1.1. Typical Parameter Variation with Voltage and Temperature (Packaged Parts) ................ 24
10.2. Parameters For Die .................................................................................................................. 25
10.2.1. Typical Parameter Variation with Voltage and Temperature (Die) .................................... 28
10.3. Parameters For Push-Button Mode.......................................................................................... 29
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 37
12.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ...................... 38
12.5. ISD2560/75/95/120 Product Bonding Physical Layout (Die)
[1]
................................................ 39
13. ORDERING INFORMATION........................................................................................................... 41
14. VERSION HISTORY ....................................................................................................................... 42
-4-
ISD2560/75/90/120
5. PIN CONFIGURATION
A0/M0
A1/M1
A2/M2
A3/M3
A4/M4
A5/M5
A6/M6
A7
A8
A9
AUX IN
V
SSD
V
SSA
SP +
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
V
CCD
P/R
XCLK
EOM
PD
CE
OVF
OVF
CE
PD
EOM
XCLK
P/R
V
CCD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
ANA OUT
ANA IN
AGC
MIC REF
MIC
V
CCA
SP-
SP+
V
SSA
V
SSD
AUX IN
A9
A8
A7
ISD2560*
22
21
20
19
18
17
16
15
ANA OUT A0/M0
ANA IN
AGC
A1/M1
A2/M2
ISD2560*
22
21
20
19
18
17
16
15
MIC REF A3/M3
MIC
V
CCA
SP-
A4M4
A5/M5
A6/M6
SOIC/PDIP
TSOP
* Same pinouts for ISD2575 / 2590 / 25120 products
-5-
Publication Release Date: April 24, 2006
Revision 1.2
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