Crystal oscillator
32kHz CRYSTAL OSCILLATOR
SG-3032JC
• No adjustment required with 32.768kHz crystal unit built-in.
• Use of C-MOS IC enables reduction of current consumption.
• Small suited to high-density mounting.
Actual size
Specifications (characteristics)
Item
Output frequency range
Power source voltage
Temperature range
Max. supply voltage
Operating voltage
Symbol
f
0
V
DD
-GND
V
DD
T
STG
T
OPR
T
SOL
∆f/f
0
Specifications
32.768 kHz
-0.3V to +4.3V
1.8V to 3.6V
Remarks
Storage temperature
Operating temperature
-55˚C to +125˚C
-20˚C to +70˚C
Twice at Under 260˚C within 10 sec.
B: 5±23ppm C: 5±50ppm D: 5±100ppm
+10ppm / -120ppm
±2ppm /V max.
V
DD
=3.3V Ta=25˚C
-20˚C to +70˚C, taking Ta=25˚C as the reference
Ta=25˚C
No load condition
1/2 V
DD
level
I
OH
= -50mA
I
OL
=+0.5mA
C-MOS load
C-MOS load:20%/80%
V
DD
C-MOS load:80%/20% V
DD
For more than 1ms until V
DD
=0V→1.8V.
3s max.
±5ppm/year max.
±5ppm max.
Time at 1.8V to be 0 sec.
Ta=25˚C, V
DD
=3.3V, first year
Soldering condition
Frequency tolerance
Frequency temperature characteristics
Frequency voltage characteristics
Current consumption
Duty
Output voltage
Output load condition (fan out)
Output rise time
Output fall time
Oscillation start up time
Aging
Shock resistance
l
OP
t
W
/
t
V
OH
V
OL
C
L
t
TLH
t
THL
t
OSC
fa
S.R.
5µA max.
40% to 60%
V
DD
-0.4V min.
0.4V max.
15pF max.
100ns max.
100ns max.
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/ 2 sine wave in 3
directions
Unless otherwise stated, characteristics (specifications) shown in the above table are based on the rated operating temperature and voltage condition.
External dimensions
(Unit: mm)
Recommended soldering pattern
(Unit: mm)
10.5 max.
#4
#3
NO. Pin terminal
1
2
3
NC
GND
OUT
V
DD
SG3032 B
E 9123A
#1
#2
5.0
4
5.8max.
0.05
min.
2.7
max.
0.5
5.08
(1.0)
3.6
(1.0)
1.3
3.8
1.3
2.1
2.5
2.1
30
THE CRYSTALMASTER
ENERGY SAVING EPSON
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
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Resource
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