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ISD4003-04MZD: 产品描述Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19; 产品类别模拟混合信号IC 消费电路; 文件大小2MB，共30页; 制造商Winbond(华邦电子); 官网地址http://www.winbond.com.tw

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ISD4003-04MZD概述

Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19

ISD4003-04MZD规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	BGA
包装说明	CSP-19
针数	19
Reach Compliance Code	not_compliant
应用	HAND-HELD DEVICES
商用集成电路类型	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码	R-PBGA-B19
JESD-609代码	e0
长度	7.45 mm
功能数量	1
端子数量	19
最高工作温度	70 °C
最低工作温度	-20 °C
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装等效代码	BGA19,4X5,30
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3 V
认证状态	Not Qualified
最长读取时间	240 s
座面最大高度	0.85 mm
最大压摆率	40 mA
最大供电电压 (Vsup)	3.3 V
最小供电电压 (Vsup)	2.7 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	4.7 mm
Base Number Matches	1

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ISD4003 Series

Single-Chip Voice Record/Playback Devices

4-, 5-, 6-, and 8-Minute Durations

GENERAL DESCRIPTION

The ISD4003 ChipCorder

Products provide high-

quality, 3-volt, single-chip Record/Playback solu-

tions for 4- to 8-minute messaging applications

which are ideal for cellular phones and other por-

table products. The CMOS-based devices include

an on-chip oscillator, antialiasing filter, smoothing

filter, AutoMute™ feature, audio amplifier, and

high density, multilevel Flash storage array. The

ISD4003 series is designed to be used in a micro-

processor- or microcontroller-based system. Ad-

dress and control are accomplished through a

Serial Peripheral Interface (SPI) or Microwire Serial

Interface to minimize pin count.

Recordings are stored in on-chip nonvolatile

memory cells, providing zero-power message

storage. This unique, single-chip solution is made

possible through ISD’s patented multilevel storage

technology. Voice and audio signals are stored

directly into memory in their natural form, providing

high-quality, solid-state voice reproduction.

Figure: ISD4003 Series Block Diagram

June 2000

ISD/Winbond · 2727 North First Street, San Jose, CA 95134 · TEL: 408/943-6666 · FAX: 408/544-1787 · http://www.isd.com

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Voice Solutions in Silicon™

ISD4003-04MZD相似产品对比

	ISD4003-04MZD	ISD4003-05MZD	ISD4003-08MZD	ISD4003-06MZD	ISD4003-05MZI
描述	Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 300s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 480s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 360s, CMOS, PBGA19, CSP-19	Speech Synthesizer With RCDG, 300s, CMOS, PBGA19, CSP-19
是否Rohs认证	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	BGA	BGA
包装说明	CSP-19	CSP-19	CSP-19	CSP-19	CSP-19
针数	19	19	19	19	19
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
应用	HAND-HELD DEVICES	HAND-HELD DEVICES	HAND-HELD DEVICES	HAND-HELD DEVICES	HAND-HELD DEVICES
商用集成电路类型	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码	R-PBGA-B19	R-PBGA-B19	R-PBGA-B19	R-PBGA-B19	R-PBGA-B19
JESD-609代码	e0	e0	e0	e0	e0
长度	7.45 mm	7.45 mm	7.45 mm	7.45 mm	7.45 mm
功能数量	1	1	1	1	1
端子数量	19	19	19	19	19
最高工作温度	70 °C	70 °C	70 °C	70 °C	85 °C
最低工作温度	-20 °C	-20 °C	-20 °C	-20 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装等效代码	BGA19,4X5,30	BGA19,4X5,30	BGA19,4X5,30	BGA19,4X5,30	BGA19,4X5,30
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3 V	3 V	3 V	3 V	3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最长读取时间	240 s	300 s	480 s	360 s	300 s
座面最大高度	0.85 mm	0.85 mm	0.85 mm	0.85 mm	0.85 mm
最大压摆率	40 mA	40 mA	40 mA	40 mA	40 mA
最大供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	BALL	BALL
端子节距	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	4.7 mm	4.7 mm	4.7 mm	4.7 mm	4.7 mm
Base Number Matches	1	1	1	1	1

ISD4003-04MZD

ISD4003-04MZD概述

ISD4003-04MZD规格参数

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