ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 24.51 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 14 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8965801RX | 54ACT534FMQB | 5962-8965801SX | 54ACT534DMQB | 5962-89658012X | CHP21001003F | |
|---|---|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, FLATPACK-16 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, FLATPACK-16 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | ACT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | Fixed Resistor, Metal Glaze/thick Film, 2W, 100000ohm, 500V, 1% +/-Tol, 100ppm/Cel, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant |
| 端子数量 | 16 | 16 | 16 | 16 | 20 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 150 °C |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | CYLINDRICAL PACKAGE |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER | MELF |
| 表面贴装 | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | METAL GLAZE/THICK FILM |
| 包装说明 | DIP, | DFP, FL20,.3 | DFP, | DIP, DIP20,.3 | QCCN, | - |
| 系列 | ACT | ACT | ACT | ACT | ACT | - |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | - |
| 长度 | 24.51 mm | 9.6645 mm | 9.6645 mm | 19.43 mm | 8.89 mm | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - |
| 封装代码 | DIP | DFP | DFP | DIP | QCCN | - |
| 传播延迟（tpd） | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
| 座面最大高度 | 5.08 mm | 2.032 mm | 2.032 mm | 5.08 mm | 1.905 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | NO LEAD | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | - |
| 宽度 | 7.62 mm | 6.604 mm | 6.604 mm | 7.62 mm | 8.89 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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