EE PLD, 8 ns, PQFP100
电子可编程逻辑器件, 8 ns, PQFP100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | BGA |
包装说明 | CABGA-100 |
针数 | 100 |
Reach Compliance Code | _compli |
ECCN代码 | EAR99 |
其他特性 | YES |
最大时钟频率 | 95 MHz |
系统内可编程 | YES |
JESD-30 代码 | S-PBGA-B100 |
JESD-609代码 | e0 |
JTAG BST | YES |
长度 | 10 mm |
湿度敏感等级 | 3 |
专用输入次数 | |
I/O 线路数量 | 64 |
宏单元数 | 64 |
端子数量 | 100 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 0 DEDICATED INPUTS, 64 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装等效代码 | BGA100,10X10,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 |
电源 | 2.5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 10 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.5 mm |
最大供电电压 | 2.7 V |
最小供电电压 | 2.3 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 10 mm |
Base Number Matches | 1 |
ispLSI2064VL-135LB100 | 2064VL | ispLSI2064VL-100LT100 | ispLSI2064VL-135LT44 | ispLSI2064VL-135LT100 | ispLSI2064VL-165LJ44 | ispLSI2064VL-165LB100 | ispLSI2064VL-165LT100 | |
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描述 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 | EE PLD, 8 ns, PQFP100 |
端子数量 | 100 | 100 | 100 | 44 | 100 | 44 | 100 | 100 |
组织 | 0 DEDICATED INPUTS, 64 I/O | 0 DEDICATED INPUTS, 64 I/O | 0 DEDICATED INPUTS, 64 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 64 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 64 I/O | 0 DEDICATED INPUTS, 64 I/O |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
表面贴装 | YES | Yes | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | BALL | GULL WING |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD | BOTTOM | QUAD |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | BGA | - | QFP | QFP | QFP | LCC | BGA | QFP |
包装说明 | CABGA-100 | - | TQFP-100 | TQFP-44 | TQFP-100 | PLASTIC, LCC-44 | CABGA-100 | TQFP-100 |
针数 | 100 | - | 100 | 44 | 100 | 44 | 100 | 100 |
Reach Compliance Code | _compli | - | _compli | unknow | _compli | unknow | _compli | _compli |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | YES | - | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 95 MHz | - | 77 MHz | 95 MHz | 95 MHz | 118 MHz | 118 MHz | 118 MHz |
系统内可编程 | YES | - | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B100 | - | S-PQFP-G100 | S-PQFP-G44 | S-PQFP-G100 | S-PQCC-J44 | S-PBGA-B100 | S-PQFP-G100 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 |
JTAG BST | YES | - | YES | YES | YES | YES | YES | YES |
长度 | 10 mm | - | 14 mm | 10 mm | 14 mm | 16.5862 mm | 10 mm | 14 mm |
湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 64 | - | 64 | 32 | 64 | 32 | 64 | 64 |
宏单元数 | 64 | - | 64 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出函数 | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | - | LFQFP | QFP | LFQFP | QCCJ | LFBGA | LFQFP |
封装等效代码 | BGA100,10X10,32 | - | QFP100,.63SQ,20 | QFP44,.47SQ,32 | QFP100,.63SQ,20 | LDCC44,.7SQ | BGA100,10X10,32 | QFP100,.63SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | CHIP CARRIER | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 | - | 240 | 240 | 240 | 225 | 240 | 240 |
电源 | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
传播延迟 | 10 ns | - | 13 ns | 10 ns | 10 ns | 8 ns | 8 ns | 8 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.5 mm | - | 1.6 mm | - | 1.6 mm | 4.57 mm | 1.5 mm | 1.6 mm |
最大供电电压 | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) |
端子节距 | 0.8 mm | - | 0.5 mm | 0.8 mm | 0.5 mm | 1.27 mm | 0.8 mm | 0.5 mm |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 |
宽度 | 10 mm | - | 14 mm | 10 mm | 14 mm | 16.5862 mm | 10 mm | 14 mm |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
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