HS-9008RH
Data Sheet
August 1999
File Number
3279.3
Radiation Hardened CMOS 8-Bit Flash
Analog-to-Digital Converter
The Intersil HS-9008RH is a CMOS 8-Bit Flash Converter
designed for space applications where relatively low power,
exceptional accuracy and very fast conversion speeds are a
necessity.
The HS-9008RH design differs substantially from most other
available Flash Converters as it employs fully differential
analog input sampling networks and amplifiers, as well as
regenerative, offset nulled (error correcting) comparators.
These circuit techniques improve noise performance and
render the circuit much less sensitive to process and
radiation induced device parametric shifts. Outstanding
integral and differential linearity error is achieved through the
use of a metal film resistor network which exhibits >10-bit
linearity without trim. As a result of these innovations, the
device operates with a single fixed reference supply as
opposed to the multiple, adjustable references used in
similar devices.
This combination of features makes the HS-9008RH one of
the best 8-Bit Flash Converters available in the Commercial,
Military or Rad Hard markets.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96696. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/space.htm
Features
• Electrically Screened to SMD # 5962-96696
• QML Qualified per MIL-PRF-38535 Requirements
• Excellent Noise Rejection - Fully Differential Design
• Superior Linearity . . . . . . . . . . . . . . . . . . . . . . 0.5 LSB Typ
• Single Reference Supply
• Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . 330mW Typ
• Sampling Rate (50ns Conversion Time). . . . . . . . . 20MHz
• Total Dose Hardness . . . . . . . . . . . . . . . . . . . . . 300kRAD
• Available with QML Class V or Class Q Screening
Pinouts
HS-9008RH (SBDIP) CDIP2-T28
TOP VIEW
1
/ R 1
2
28 V
SSD
27 V
IN
26 V
SSD
25 V
SSA
24 V
REF
+
23 V
DDA
22 OF
21 B8 (MSB)
20 B7
19 B6
18 B5
17 V
SSA
16 V
SSD
15 V
DDD
V
DDD
2
CLK 3
V
DDD
4
V
SSA
5
V
REF
- 6
V
DDA
7
(LSB) B1 8
B2 9
B3 10
B4 11
CE1 12
CE2 13
Ordering Information
ORDERING NUMBER
5962F9669601QXC
5962F9669601QYC
5962F9669601VXC
5962F9669601VYC
HS1-9008RH/Proto
HS9-9008RH/Proto
HS0-9008RH-Q
INTERNAL
MKT. NUMBER
HS1-9008RH-8
HS9-9008RH-8
HS1-9008RH-Q
HS9-9008RH-Q
HS1-9008RH/Proto
HS9-9008RH/Proto
HS0-9008RH-Q
TEMP. RANGE
(
o
C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
25
1
/ R
2
V
DDA
14
HS-900RH (FLATPACK) CDFP3-F28
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
SSD
V
IN
V
SSD
V
SSA
V
REF
+
V
DDA
OF
B8 (MSB)
B7
B6
B5
V
SSA
V
SSD
V
DDD
V
DDD
CLK
V
DDD
V
SSA
V
REF
-
V
DDA
(LSB) B1
B2
B3
B4
CE1
CE2
V
DDA
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
HS-9008RH
Die Characteristics
DIE DIMENSIONS:
180 mils x 197 mils x 21
±1
mils
INTERFACE MATERIALS:
Glassivation:
Type: SiO
2
Thickness: 8k
Å
±1k
Å
Top Metallization:
Metal 1 - Type: Moly/TiW
Thickness: 5.8k
Å
±10%
Metal 2- Type: Al/Si/Cu
Thickness: 10k
Å
±10%
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
V
DD
ADDITIONAL INFORMATION:
Worst Case Current Density:
Metal 1 - Designs using the Intersil AVLSI-1RA process
take advantage of the superior current carrying
capabilities of Moly.TiW. The current density limit
established by Intersil Reliability is 5.0 x 10
5
A/cm
2
Metal 2 - 1.63 x 10
5
A/cm
2
Process:
AVLSI1RA
Metallization Mask Layout
HS-9008RH
VDDD2
CLK
VDDD1
1/2R
VSSD1
VIN
VSSD2
VSSA2
VSSA1
VREF-
VREF+
VDDA2
VDDA1
B1
OF
B2
B8
B3
B7
B4
B6
CE1
CE2
VDDA3 VDDD3 VSSD3
VSSA3
B5
4
HS-9008RH
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
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7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
5
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