Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> HD6432648

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HD6432648: 产品描述Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小3MB，共1141页; 制造商Hitachi （Renesas ）; 官网地址http://www.renesas.com/eng/

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HD6432648概述

Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144

HD6432648规格参数

参数名称	属性值
零件包装代码	QFP
包装说明	FQFP, QFP144,.87SQ,20
针数	144
Reach Compliance Code	unknown
具有ADC	YES
地址总线宽度	24
位大小	16
CPU系列	H8S/2600
最大时钟频率	20 MHz
DAC 通道	NO
DMA 通道	NO
外部数据总线宽度	16
JESD-30 代码	S-PQFP-G144
长度	20 mm
I/O 线路数量	108
端子数量	144
最高工作温度	85 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	FQFP
封装等效代码	QFP144,.87SQ,20
封装形状	SQUARE
封装形式	FLATPACK, FINE PITCH
电源	5 V
认证状态	Not Qualified
RAM（字节）	4096
ROM（单词）	65536
ROM可编程性	MROM
座面最大高度	3.05 mm
速度	20 MHz
最大压摆率	80 mA
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER
Base Number Matches	1

文档解析

F-ZTAT™（Flash-Zero Time Assertion）是日立公司（Hitachi, Ltd.）开发的一种闪存技术，它被应用于H8S/2646系列微控制器中的ROM。根据提供的文档内容，F-ZTAT™闪存技术具有以下特点和优势：

快速可编程性：F-ZTAT™技术允许在极短的时间内重新编程ROM，这意味着在生产过程中或之后，可以快速更新或更改程序，从而提高了生产效率和灵活性。
灵活性：由于F-ZTAT™闪存可以被重新编程，它允许产品在设计后期或生产过程中根据需要进行规格更改，而不需要重新制造或更换芯片。
适用于大规模生产：F-ZTAT™闪存技术特别适用于应用设备，其规格可能会在早期生产阶段到全面大规模生产期间发生变化。
高可靠性：F-ZTAT™闪存技术提供高可靠性的数据存储，这对于需要长时间稳定运行的应用系统非常重要。
非易失性存储：作为闪存技术，F-ZTAT™存储的数据在断电情况下不会丢失，保证了数据的持久性。
减少库存成本：由于F-ZTAT™闪存允许在生产后期进行编程，这可以减少因产品规格不同而导致的库存成本。
提高产品竞争力：通过使用F-ZTAT™技术，产品可以更快地响应市场变化，快速推出更新版本，从而提高市场竞争力。

在H8S/2646系列微控制器中，F-ZTAT™闪存技术主要应用于内部ROM，这些ROM作为芯片的一部分，通过16位数据总线与CPU相连，允许以字节和字的方式访问数据，加快了指令获取速度，提高了处理速度。这种技术的应用使得H8S/2646系列微控制器在嵌入式系统中具有显著的优势，特别是在需要快速响应和高可靠性的应用场合。

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Hitachi 16-Bit Single-Chip Microcomputer

H8S/2646 Series

H8S/2646

HD6432646

H8S/2645

HD6432645

H8S/2647

HD6432647

H8S/2648

HD6432648

H8S/2646R F-ZTAT™

HD64F2646R

H8S/2648R F-ZTAT™

HD64F2648R

Hardware Manual

ADE-602-207B

Rev. 3.0

9/17/01

Hitachi, Ltd.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

The H8S/2646 Series is a series of high-performance microcontrollers with a 32-bit H8S/2600

CPU core, and a set of on-chip supporting functions required for system configuration.

This LSI is equipped with a 16-bit timer pulse unit (TPU), programmable pulse generator (PPG),

watchdog timer (WDT), serial communication interface (SCI), A/D converter, motor control

PWM timer (PWM), LCD controller/driver (LCDC) and I/O ports as on-chip supporting modules.

In addition, data transfer controller (DTC) is provided, enabling high-speed data transfer without

CPU intervention. This LSI is suitable for use as an embedded processor for high-level control

systems. Its on-chip ROM are flash memory (F-ZTAT™*) that provides flexibility as it can be

reprogrammed in no time to cope with all situations from the early stages of mass production to

full-scale mass production. This is particularly applicable to application devices with

specifications that will most probably change.

Note: * F-ZTAT™ is a trademark of Hitachi, Ltd.

Target Users: This manual was written for users who will be using the H8S/2646 Series in the

design of application systems. Members of this audience are expected to understand

the fundamentals of electrical circuits, logical circuits, and microcomputers.

Objective:

This manual was written to explain the hardware functions and electrical

characteristics of the H8S/2646 Series to the above audience. Refer to the

H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description

of the instruction set.

Notes on reading this manual:

•

In order to understand the overall functions of the chip

Read the manual according to the contents. This manual can be roughly categorized into parts

on the CPU, system control functions, peripheral functions and electrical characteristics.

•

In order to understand the details of the CPU's functions

Read the H8S/2600 Series, H8S/2000 Series Programming Manual.

•

In order to understand the details of a register when its name is known

The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal

I/O Registers.

Example: Bit order: The MSB is on the left and the LSB is on the right.

Related Manuals:

The latest versions of all related manuals are available from our web site.

Please ensure you have the latest versions of all documents you require.

http://www.hitachisemiconductor.com/

HD6432648相似产品对比

	HD6432648	HD6432646	HD6432645	HD6432647
描述	Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144	Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144	Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144	Microcontroller, 16-Bit, MROM, H8S/2600 CPU, 20MHz, CMOS, PQFP144, PLASTIC, QFP-144
零件包装代码	QFP	QFP	QFP	QFP
包装说明	FQFP, QFP144,.87SQ,20	FQFP, QFP144,.87SQ,20	FQFP, QFP144,.87SQ,20	FQFP, QFP144,.87SQ,20
针数	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	unknown
具有ADC	YES	YES	YES	YES
地址总线宽度	24	24	24	24
位大小	16	16	16	16
CPU系列	H8S/2600	H8S/2600	H8S/2600	H8S/2600
最大时钟频率	20 MHz	20 MHz	20 MHz	20 MHz
DAC 通道	NO	NO	NO	NO
DMA 通道	NO	NO	NO	NO
外部数据总线宽度	16	16	16	16
JESD-30 代码	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144
长度	20 mm	20 mm	20 mm	20 mm
I/O 线路数量	108	108	108	108
端子数量	144	144	144	144
最高工作温度	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FQFP	FQFP	FQFP	FQFP
封装等效代码	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH
电源	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	4096	4096	2048	2048
ROM（单词）	65536	131072	65536	131072
ROM可编程性	MROM	MROM	MROM	MROM
座面最大高度	3.05 mm	3.05 mm	3.05 mm	3.05 mm
速度	20 MHz	20 MHz	20 MHz	20 MHz
最大压摆率	80 mA	80 mA	80 mA	80 mA
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD
宽度	20 mm	20 mm	20 mm	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1	1

HD6432648

HD6432648概述

HD6432648规格参数

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HD6432648相似产品对比

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