5.0 mm x 7.0 mm Ceramic Package SMD Oscillator
ISM81 Series
Product Features:
Wide Temperature Range (-55º to +125ºC)
Frequency Stability option ±50 ppm over the full operating temperature range.
Low Phase Noise
RoHS Compliant
Frequency
Output Level
CMOS
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
1.000 MHz to 125.000 MHz
Logic ‘0’ = 10% of Vcc max
Logic ‘1’ = 90% of Vcc min
Specify 50% ±10% or ±5% See Table in Part Number Guide
5 nS Max. for 10% to 90% of waveform
15 pF
See Frequency Stability Table (Includes room temperature tolerance
and stability over operating temperature)
±3 ppm max
5 mS Max.
See Input Voltage Table, tolerance ±5 %
50 mA Max.
1.50
7.00
IYWW
FREQ
5.00
1.70 max
5.08
1
4
1.40
2
2.60
Aging (Initial First
Year)
Start-up Time
Supply Voltage
Current
Operating
Storage
Phase Jitter:
(12kHz – 20MHz)
Tri-State (Pin 1)
Function
Enable / Disable Time
Current, Standby Mode
3
5.08
0.01
uF
3.70
-55
C to +125
C
-55
C to +125
C
1 pS RMS max
Standby
100 nS Max. N.C. or
≥
70% Vcc = Enable.
≤
30% Vcc = Disable
20 µA
2.40
Recommended
Pad Layout
Pin Connections
PIN 1
PIN 2
PIN 3
PIN 4
Enable / Disable
or NC
Ground
Output
Vcc
Dimension Units: mm
Part Number Guide
Input
Package
Voltage
1 = 1 .8 V
2 = 2.7 V
3 = 3.3 V
6 = 2.5 V
7 = 3.0 V
Sample Part Number:
Operating
Temperature
7
= -55ºC to +125ºC
Symmetry
(Duty Cycle)
5 = 45 / 55 max
6 = 40 / 60 max
Output
3 = 15pF
6 = 30pF *
ISM81-3756BH-20.000
Stability (in
Enable /
Frequency
ppm)
Disable
B = ±50 ppm
C= ±100 ppm
H = Enable
O = N/C
20.000
ISM81
*Oscillator
may not meet 5% symmetry over temperature range with 30 pF load.
NOTE:
A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
07/14/14_A2
Specifications subject to change without notice
Page 1
5.0 mm x 7.0 mm Ceramic Package SMD Oscillator
Pb Free Solder Reflow Profile:
Typical Application:
ISM81 Series
*Units are backward compatible with 240º C reflow processes
Package Information:
MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
Proprietary and Confidential
This document contains proprietary information, and such information may not be disclosed to others for any purpose nor
used for manufacturing purpose without the written permission of ILSI America.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
07/14/14_A2
Specifications subject to change without notice
Page 2
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
