Dual Channel, High Speed
Optocouplers
Technical Data
HCPL-2530
HCPL-2531
HCPL-4534
HCPL-0530
HCPL-0531
HCPL-0534
Features
• 15 kV/
µ
s Minimum Common
Mode Transient Immunity at
V
CM
= 1500 V
(HCPL-4534/0534)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8 Pin DIP, SO-8,
and 8 Pin DIP – Gull Wing
Surface Mount (Option 020)
Packages
• High Density Packaging
• 3 MHz Bandwidth
• Open Collector Outputs
• Guaranteed Performance
from 0
°
C to 70
°
C
• Safety Approval
UL Recognized – 3750 V rms
for 1 minute (5000 V rms for
1 minute for Option 020) per
UL1577
CSA Approved
• Single Channel Version
Available (4502/3, 0452/3)
• MIL-PRF-38534 Hermetic
Version Available
(55XX/65XX/4N55)
Applications
• Line Receivers –
High
Common Mode Transient
Immunity (>1000 V/µs) and
Low Input-Output Capacitance
(0.6 pF)
• High Speed Logic Ground
Isolation –
TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL
• Replace Pulse Transformers
–
Save Board Space and Weight
•
Analog Signal Ground
Isolation
– Integrated Photon
Detector Provides Improved
Linearity over Phototransistor
Type
• Polarity Sensing
• Isolated Analog Amplifier –
Dual Channel Packaging
Enhances Thermal Tracking
Description
These dual channel optocouplers
contain a pair of light emitting
diodes and integrated photodetec-
tors with electrical insulation
between input and output.
Separate connection for the
photodiode bias and output
transistor collectors increase the
speed up to a hundred times that
of a conventional phototransistor
coupler by reducing the base-
collector capacitance.
Functional Diagram
ANODE
1
1
CATHODE
1
2
CATHODE
2
3
ANODE
2
4
8 V
CC
7 V
O1
6 V
O2
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
V
O
ON
LOW
OFF
HIGH
A 0.1
µF
bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
These dual channel optocouplers
are available in an 8 Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8 Pin
DIP part number and the
electrically equivalent SO-8 part
number.
SO-8
Package
HCPL-0530
HCPL-0531
HCPL-0534
The SO-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCPL-2530/0530 is for use in
TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
the HCPL-2530/0530 is 7%
minimum at I
F
= 16 mA.
The HCPL-2531/0531 is designed
for high speed TTL/TTL
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 kΩ pull-up resistor. CTR of
the HCPL-2531/0531 is 19%
minimum at I
F
= 16 mA.
The HCPL-4534/0534 is an
HCPL-2531/0531 with increased
common mode transient immunity
of 15,000 V/µs minimum at
V
CM
= 1500 V guaranteed.
8 Pin DIP
HCPL-2530
HCPL-2531
HCPL-4534
Selection Guide
Minimum CMR
dV/dt
(V/
µ
s)
1,000
V
CM
(V)
10
Current
Transfer
Ratio (%)
7
19
19
9
8-pin DIP (300 Mil)
Dual
Single
Channel
Channel
Package
Package*
HCPL-2530
6N135
HCPL-2531
6N136
HCPL-4502
HCPL-4534 HCPL-4503
Small-Outline SO-8
Dual
Single
Channel
Channel
Package
Package*
HCPL-0530
HCPL-0500
HCPL-0531
HCPL-0501
HCPL-0452
HCPL-0534
HCPL-0453
Widebody
(400 Mil)
Single
Channel
Package*
HCNW135
HCNW136
HCNW4502
HCNW4503
Hermetic
Single and
Dual Channel
Packages*
15,000
1,000
1500
10
HCPL-55XX
HCPL-65XX
4N55
*Technical data for these products are on separate Agilent publications.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2531#XXXX
020 = UL 5000 V rms/1 Minute Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
*For HCPL-2530/1 and HCPL-4534 only.
†Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
3
Schematic
1
+
V
F1
–
2
I
F1
I
CC
8
V
CC
I
O1
7
V
O1
3
–
V
F2
+
4
I
F2
I
O2
6
V
O2
GND
5
HCPL-4534/0534 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/2531/4534)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS.
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
4
Package Outline Drawings, continued
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package (HCPL-0530/0531/0534)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
1
2
3
1.9 (0.075)
1.270 BSC
(0.050)
7°
0.406 ± 0.076
(0.016 ± 0.003)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
5
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
t
L
60 to 150 SEC.
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
Regulatory Information
The devices contained in this data
sheet have been approved by the
following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
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