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382876-1

产品描述SOCKET, PGA1201, IC SOCKET
产品类别连接器    插座   
文件大小106KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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382876-1概述

SOCKET, PGA1201, IC SOCKET

382876-1规格参数

参数名称属性值
Reach Compliance Codeunknown
ECCN代码EAR99
联系完成配合GOLD (30)
联系完成终止TIN LEAD OVER NICKEL
设备插槽类型IC SOCKET
使用的设备类型PGA1201
外壳材料LIQUID CRYSTAL POLYMER
JESD-609代码e0
制造商序列号382876
触点数1201
Base Number Matches1

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382876-1
T E I nternal N umber: 3 8 2 8 7 6 - 1
Product Highlights:
l
Zero Insertion Force
l
Number of Positions = 1201
l
PC B Mount Style = Through Hole
l
Grid Size = 25x25
l
Grid Spacing = Interstitial: 1.27 x 2.54 mm
View all Features
Obsolete
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
I C SOC KETS
(PDF, English)
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Insertion Force
= Zero
l
Number of Positions
= 1201
l
PC B Mount Style = Through Hole
l
Grid Size
= 25x25
l
Grid Spacing (mm [in])
= Interstitial: 1.27 x 2.54 [.050 x .100]
l
C hip C ompatibility
= Other
l
Frame Style
= C losed
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Heat Sink Attachment
= Without
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ZIF Actuator
= Handle
l
Profile
= Standard
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C over Material = Liquid C rystal Polymer (LC P)
Electrical Characteristics:
l
Insulation Resistance (M?) = 5,000
Termination Related Features:
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Termination Post Length (mm [in])
= 4.32 [0.170]
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Socket Identifier = None
l
Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
Assembly Process Feature = None
l
Actuator Handle Material = Zinc Alloy (C hromate Treated)
Contact Related Features:
l
C ontact Style
= Stamped + Formed
l
C ontact Base Material = C opper Alloy
l
C ontact Mating Area Plating Material = Gold (30)
Housing Related Features:
l
Housing C olor = Blue
l
Housing Material = Liquid C rystal Polymer (LC P)
l
Housing Flammability Rating = UL 94V-0
l
Housing Material Temperature = High
Industry Standards:
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RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Operation/Application:
l
Application
= Test/Burn-In
Packaging Related Features:
l
Packaging Method = Tray
Other:
l
Brand = AMP
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
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2009 Tyco Electronics C orporation All Rights Reserved
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